Terminal Block Alignment Mark Integration for Substrate Miniaturization
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Solution Overview
Problem
Existing electro-optical apparatuses face challenges in reducing the size of substrates while maintaining accurate alignment and electrical connection due to the need for separate alignment marks and terminal blocks, which complicates positional adjustment and increases the risk of misalignment.
Innovation Solution
A mounting structure where alignment marks are formed by partially cutting away terminals on both substrates, allowing for narrower gaps and more precise positioning without the need for separate alignment marks, enabling reduced substrate size and improved accuracy in terminal alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate alignment marks are formed on terminal blocks, then positional adjustment between substrates is enabled, but the substrate size increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the alignment mark function with the terminal block structure by forming the alignment mark within the terminal block area itself. The alignment mark is created by removing the conductive layer and insulating layer from a specific region of the terminal block, allowing the terminal block to serve dual purposes: electrical connection and alignment reference, thereby eliminating the need for separate alignment marks and reducing substrate size
Solution Approach 2:
The terminal block is designed to perform multiple functions simultaneously: it provides electrical connection through its conductive structure and serves as an alignment reference through the alignment mark formed within it. This multi-functionality eliminates the need for dedicated alignment marks, reducing the overall substrate area while maintaining alignment precision
2Area of stationary object
If terminal blocks are made narrower to reduce substrate size, then substrate miniaturization is achieved, but alignment accuracy deteriorates
Solution Approach 1:
The patent applies local quality by creating a specific region within the terminal block with different properties - the alignment mark area has removed conductive and insulating layers, making it visually distinct and suitable for alignment purposes. This localized modification allows the terminal block to maintain its electrical function while providing a dedicated alignment reference region, ensuring accurate positioning even in miniaturized substrates
3Area of stationary object
If alignment marks are formed by partially cutting away terminals, then the gap between terminal blocks is narrowed, but terminal structural integrity may be compromised
Solution Approach 1:
The patent applies partial action by removing only the conductive layer and insulating layer from a specific portion of the terminal block to form the alignment mark, while leaving the underlying substrate and terminal structure intact. This partial removal is sufficient to create a visible alignment reference without compromising the structural integrity or electrical function of the terminal block, allowing narrow gaps while maintaining strength
Data Source
AI summary
A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The first terminal and the second terminal are electrically connected to each other by being relatively positioned with respect to each other.