Terminal Assembly Structure to Prevent Resin Pullout

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Solution Overview

Problem

Existing methods for producing modules with connection conductors are prone to the conductors slipping out of the sealing resin after the link section is removed, due to inadequate adhesion.

Innovation Solution

The module design includes plate-shaped conductors with terminal sections extending from the circuit board, arranged side by side with spaces between them, which are filled with sealing resin to enhance adhesion, and support sections that increase the contact area with the circuit board electrodes, ensuring the conductors remain securely attached.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If connection conductors are made as rectangular prism (thin plate) for low cost and short production time, then manufacturing cost and production time are reduced, but the conductors can slip out of the sealing resin after link section removal

Engineering Contradiction:
Improveproduction timeVSAvoidadhesion of connection conductor to sealing resin
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The connection conductor is divided into multiple terminal sections arranged side by side with spaces between them, rather than using a single continuous rectangular prism structure. This segmentation allows sealing resin to penetrate into the spaces and bond with multiple surfaces, significantly improving adhesion while maintaining the thin plate configuration for cost-effective production

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The terminal sections are arranged with specific spacing to create localized regions where sealing resin can penetrate and bond. This creates different functional zones: the plate-shaped conductor body provides structural support, while the spaced terminal sections provide adhesion points for the sealing resin, optimizing both mechanical strength and bonding capability

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If connection conductors are made as rectangular prism (thin plate) to reduce manufacturing cost, then production cost is reduced, but the conductors can slip out of the sealing resin after link section removal

Engineering Contradiction:
Improvemanufacturing costVSAvoidadhesion of connection conductor to sealing resin
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The connection conductor is divided into multiple terminal sections arranged side by side with spaces between them, rather than using a single continuous rectangular prism structure. This segmentation allows sealing resin to penetrate into the spaces and bond with multiple surfaces, significantly improving adhesion while maintaining the thin plate configuration for cost-effective production

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The terminal sections extend from the plate-shaped conductor in a direction away from the circuit board, creating a three-dimensional structure with spaces between sections. This dimensional arrangement allows sealing resin to access and bond with multiple surfaces of the terminal sections, enhancing adhesion without requiring a completely different conductor geometry

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11895769B2Module, terminal assembly, and method for producing module
Publication Date: 2024.02.06 MURATA MFG CO LTD
  • US11895769B2 patent drawing
  • US11895769B2 patent drawing
  • US11895769B2 patent drawing

AI summary

A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.