Semiconductor Terminal Block Layout for Creepage Insulation
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Solution Overview
Problem
The conventional semiconductor apparatus experiences a decrease in insulation resistance between the terminal and the base due to peeling of the sealing material from the case's inner wall surface, leading to potential electrical failures.
Innovation Solution
The semiconductor apparatus incorporates a terminal block with a projecting portion extending at least 1 mm from the terminal's distal end, increasing the creepage distance and enhancing the adhesion of the sealing material to the case's inner wall surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the terminal block wall surface reaches the base immediately below the terminal distal end, then the device structure is compact, but the creepage distance is short and insulation resistance decreases when sealing material peels
Solution Approach 1:
The terminal block includes a projecting portion that extends in the first direction (length dimension) from the inner wall surface beyond the terminal distal end position. This dimensional extension increases the creepage distance along the inner wall surface from the base to the terminal, providing longer insulation path without increasing vertical height or compromising compact structure.
2Reliability
If the terminal block wall surface reaches the base immediately below the terminal distal end, then the device structure is compact, but the sealing material adhesion is insufficient and peeling occurs
Solution Approach 1:
The projecting portion extends the inner wall surface in the length dimension, providing additional surface area for sealing material adhesion. This extended surface allows the sealing material to bond over a longer distance along the inner wall, improving adhesion strength and preventing peeling without significantly increasing the overall device footprint.
3Reliability
If the terminal block is extended to increase creepage distance, then insulation resistance is maintained, but the device complexity increases
Solution Approach 1:
The projecting portion is integrated as part of the terminal block structure itself, merging the insulation extension function with the existing terminal block component. This unified design avoids adding separate insulation elements or complex structures, maintaining simplicity while achieving the required creepage distance and insulation resistance.
Data Source
AI summary
A semiconductor apparatus includes: a base, an insulating substrate arranged on the base, a semiconductor element arranged on the insulating substrate, a case joined to the base and housing the semiconductor element, and a sealing material supplied in the case. The case includes a terminal block that extends in a first direction from an inner wall surface of the case. The terminal block is arranged thereon a terminal that is electrically connected to the semiconductor element via a wiring member. The terminal block includes a projecting portion that extends, in plan view, in the first direction from a first position of a distal end portion of the terminal to a second position. A first distance between the first position and the second position is at least 1 mm.