Terminal Block Power Package for Simpler Vertical Pin Molding
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Solution Overview
Problem
Integration of vertically arranged terminals in a transfer molded power device is complex, and the use of hollow sleeves as holders for pin terminals complicates the molding process.
Innovation Solution
A power device design with vertically arranged terminals and a terminal block comprising a molded block with recesses for first terminals, which are easily aligned and connected to the connection regions, simplifying the transfer molding process and improving alignment tolerance and design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hollow sleeves are used as holders for pin terminals in a transfer molded power device, then the terminals can be held and positioned, but the transfer molding process becomes comparatively complicated
Solution Approach 1:
The patent removes the hollow sleeve component from the molding process entirely. Instead of using hollow sleeves as holders, the design integrates terminal positioning directly into the mold cavity structure, eliminating the intermediate holding component and simplifying the overall molding process while maintaining terminal positioning capability
Solution Approach 2:
The patent merges the terminal holder function with the mold cavity itself. The mold cavity is designed to directly receive and position the pin terminals during injection molding, combining what were previously separate functions (molding and terminal holding) into a single integrated process
2Adaptability or versatility
If vertically arranged terminals are integrated in a transfer molded power device, then the device achieves compact terminal arrangement, but the integration process becomes complex
Solution Approach 1:
The patent incorporates terminal positioning features directly into the mold cavity design before the molding process begins. The mold includes pre-designed cavities and positioning structures that automatically guide and secure the vertical terminal arrangement during injection, eliminating the need for complex post-molding integration steps
Solution Approach 2:
The patent introduces a terminal block as an intermediary component that simplifies the integration of vertically arranged terminals. The terminal block serves as a mediator between the mold cavity and the final device structure, providing a standardized interface for terminal insertion and securing, thereby reducing overall integration complexity
Data Source
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AI summary
A power device (1) is specified, comprising - at least one power semiconductor chip arranged on a mounting portion (2), - a package body (3), for the at least one power semiconductor chip, with at least one recess (4) exposing at least one partial region of a connection region (5), - a terminal block (6) comprising - a molded block (7) with at least one further recess (8), and - at least one first terminal (9) arranged in the at least one further recess (8), wherein - the terminal block (6) is arranged on the package body (3), - the at least one first terminal (9) is further arranged in the at least one recess (4) of the package body (3), - the at least one first terminal (9) is electrically connected to the at least one partial region of the connection region (5). Furthermore, a system and a method for producing a power device are specified.