Terminal Control Substrate With Switchable Replaceable IC Module
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Solution Overview
Problem
Existing electronic substrates with IC modules fixed by solder make it difficult to replace or remove IC modules without replacing the entire substrate, leading to costly waste when only one IC module fails.
Innovation Solution
A terminal control substrate with a connector for attaching an IC card or module instead of the eSIM, and a switch to reroute connections, allowing for continued operation without removing the failed component or replacing the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If IC modules are fixed on the electronic substrate with solder, then the connection reliability is improved, but the ease of repair deteriorates because it becomes difficult to remove or replace the IC module
Solution Approach 1:
The electronic substrate is segmented into two connection types: a first connection portion with soldered IC modules for high reliability, and a second connection portion with connectors for easy replacement. This segmentation allows different repair strategies for different modules.
Solution Approach 2:
Connectors are introduced as intermediary components between the electronic substrate and IC modules at the second connection portion. These connectors enable easy plugging and unplugging of IC modules without affecting the soldered connections at the first connection portion.
2Reliability
If the entire electronic substrate is replaced when an IC module fails, then the reliability of the terminal device is restored, but the loss of substance increases due to waste of the functional substrate
Solution Approach 1:
The failed IC module is extracted and replaced individually at the second connection portion using connectors, while the functional electronic substrate and other working IC modules are retained. This avoids the waste of replacing the entire substrate.
Solution Approach 2:
Only the failed IC module is discarded and replaced, while the electronic substrate and functional IC modules are recovered and continue to be used. This selective replacement minimizes material waste.
3Device complexity
If IC modules are soldered fixedly on the electronic substrate, then the device structure is simplified, but the adaptability deteriorates because the IC module cannot be replaced for different operations
Solution Approach 1:
The electronic substrate is divided into a first connection portion with soldered IC modules for stable operations and a second connection portion with connectors for replaceable IC modules, enabling both fixed and flexible configurations.
Solution Approach 2:
The second connection portion uses dynamic connectors that allow IC modules to be plugged and unplugged according to operational needs, providing adaptability while the first connection portion maintains static soldered connections for stability.
Data Source
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AI summary
According to one embodiment, a terminal control substrate includes a base plate (110, 210, 310, 410, 510) mounted on a terminal device, a first module (112, 212, 312, 412, 512) fixed to the base plate (110, 210, 310, 410, 510), an external connection terminal (113, 213a to 213c, 313, 413a to 413c, 513a to 513c) fixed to the base plate (110, 210, 310, 410, 510) and to which a component comprising a second module being a substitute for the first module (112, 212, 312, 412, 512) is attachable, a controller (111, 211, 311, 411, 511) configured to perform control in the terminal device by using the first module (112, 212, 312, 412, 512) or the second module, and a switching unit (114, 214, 314, 414, 521) configured to switch a connection destination of the controller (111, 211, 311, 411, 511) to any one of the first module (112, 212, 312, 412, 512) and the external connection terminal (113, 213a to 213c, 313, 413a to 413c, 513a to 513c) to which the second module is attached.