Terminal Device Component Nesting in Circuit Board Recess
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Solution Overview
Problem
There is a conflict between achieving small volume and high performance in terminal devices, as the size of some components significantly impacts their performance.
Innovation Solution
A terminal device design that includes a component accommodated in a recessed opening on the circuit board, allowing for a reduced installation height without compromising performance. The opening is designed to accommodate part of the component, such as a protrusion, while maintaining the insulation and protective functions of the solder mask layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the component is mounted on the surface of the circuit board, then the installation height is reduced, but the component may come into rigid contact with the circuit board under external force affecting performance
Solution Approach 1:
The component is nested within a recessed cavity formed in the circuit board, allowing the component to be positioned lower while maintaining a buffer zone. The cavity structure enables the component to be accommodated within the board thickness, reducing installation height while preventing rigid contact that would compromise reliability.
Solution Approach 2:
The solution transitions from surface mounting (2D plane) to embedded mounting (3D volume) by creating a recessed cavity in the circuit board. This dimensional change allows the component to be positioned in the thickness direction of the board, achieving both reduced installation height and protected positioning away from external forces.
2Length of stationary object
If the opening penetrates the solder mask layer, then the component can be accommodated deeper to reduce installation height, but electrical connection may cause short circuit or signal loss
Solution Approach 1:
The circuit board is designed with heterogeneous structure: the solder mask layer is selectively removed or recessed only in the specific cavity region where the component is mounted, while remaining intact in other areas. This local modification allows deeper component accommodation without compromising the overall electrical insulation and protective functions of the solder mask layer.
Solution Approach 2:
The circuit board structure is segmented into functional zones: the cavity region where the solder mask is recessed to accommodate the component, and the surrounding regions where the solder mask remains intact to provide electrical insulation. This segmentation allows the opening to effectively penetrate or recess into the cavity without causing short circuits or signal loss in other areas.
3Reliability
If the component is mounted with larger clearance from the circuit board, then the component performance is protected, but the installation height increases
Solution Approach 1:
The component is nested within the recessed cavity of the circuit board, which provides both clearance for performance protection and minimizes the overall installation height. The cavity structure allows the component to be surrounded by the board material, maintaining buffer zones while keeping the external profile compact.
Data Source
AI summary
A terminal device comprises a component and a circuit board. The circuit board comprises a circuit substrate and a solder mask layer, and wherein the circuit substrate comprises a medium layer and a circuit layer stacked with the medium layer. Openings with different depths are provided in the circuit board, and at least part of the component is accommodated in or arranged corresponding to the opening. This lowers an installation height between the component and the circuit board without affecting their performance.