Semiconductor Terminal Groove Layout for Surplus Solder Control

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Solution Overview

Problem

Existing semiconductor devices face challenges in efficiently accommodating surplus solder due to variations in component sizes, leading to increased complexity and the need for multiple types of components.

Innovation Solution

The semiconductor device incorporates a groove in the second wiring member that overlaps one or two sides of the terminal surface, allowing surplus solder to be accommodated, and this design is standardized across components with different sizes, reducing the number of component types needed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple types of components are used to accommodate variations in component sizes, then the ability to handle different sizes is improved, but the device complexity and number of component types increases

Engineering Contradiction:

Improveability to handle different component sizesVSAvoidnumber of component types

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The groove structure in the second wiring member is designed to be universal across different component sizes. The groove can accommodate surplus solder regardless of the specific size variation, allowing a single component type to handle multiple size variations. This eliminates the need for multiple specialized component types for different sizes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention addresses size variations by maintaining constant geometric parameters of the groove structure rather than changing component dimensions. The groove's position and dimensions are optimized to work across a range of component sizes, allowing the same component design to adapt to size variations without requiring multiple component types.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If the groove is positioned to overlap the terminal surface, then surplus solder accommodation is improved, but the manufacturing precision requirements increase

Engineering Contradiction:

Improvesurplus solder accommodationVSAvoidgroove positioning accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The groove is pre-positioned during component manufacturing to overlap with the terminal surface area where surplus solder is expected to accumulate. This preliminary positioning ensures that regardless of minor manufacturing variations in the terminal surface, the groove will be in the correct location to capture surplus solder, thereby improving reliability without requiring extremely tight manufacturing tolerances.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12581946B2Semiconductor device and power converter

Publication Date: 2026.03.17 DENSO CORP

AI summary

A semiconductor device includes a semiconductor element, a first wiring member, a second wiring member, and a terminal. The semiconductor element includes a first main electrode and a second main electrode on a side opposite from the first main electrode. The first wiring member is connected to the first main electrode. The terminal has a first terminal surface connected to the second main electrode and a second terminal surface. The second terminal has four sides. Two of the four sides are parallel to a first direction intersecting the thickness direction, and other two sides of the four sides are parallel to a second direction perpendicular to the thickness direction and the first direction. The second wiring member is connected to the second terminal surface of the terminal through solder, and has a groove. The groove overlaps one or two of the four sides of the second terminal surface.