Terminal Heat Control via Proximity-Adaptive Insulation and Dissipation
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Solution Overview
Problem
Terminal products face significant heating issues due to increased processor cores and frequencies, leading to user experience problems, performance reduction, and safety concerns, with existing solutions being ineffective in addressing these challenges.
Innovation Solution
A heat control method and device that detects distances between terminal regions and a detection object, performing stepped heat insulation or dissipation processing based on predetermined thresholds, using grid sub-blocks with electrodes for controlled heat management and incorporating a heat equalization process when distances exceed a certain threshold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If processor cores and frequencies are increased to enhance terminal performance, then computing power and functionality are improved, but heat generation increases significantly
Solution Approach 1:
The patent divides the terminal back cover into multiple independent heating regions corresponding to different heat-generating components (main chip, charging chip, RF amplifier, memory, LCD). Each region can be controlled independently through separate heating elements, allowing targeted heat management for each component rather than uniform heating across the entire device.
Solution Approach 2:
The patent applies different heating control strategies to different regions based on their specific thermal characteristics and user contact patterns. Regions closer to the user's hand receive different heating treatment compared to regions farther away, optimizing both thermal management and user comfort based on local requirements.
2Weight of moving object
If terminal products are lightened and thinned to improve portability, then device compactness is enhanced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a temporal dimension to heat management by dynamically adjusting heating intensity based on real-time temperature feedback and usage scenarios. Instead of relying solely on spatial heat dissipation structures, the system controls heat generation and dissipation over time, allowing thin devices to manage heat effectively through temporal regulation rather than requiring bulky passive cooling structures.
3Object-affected harmful factors
If heat insulation processing is applied to prevent user discomfort, then user experience is improved, but heat accumulation increases causing safety concerns
Solution Approach 1:
The patent implements a closed-loop feedback control system that continuously monitors temperature in each heating region and adjusts heating element output accordingly. When temperature reaches predetermined thresholds, the system automatically reduces or stops heating in that region, preventing dangerous heat accumulation while maintaining user comfort. This dynamic adjustment ensures safety by responding to real-time thermal conditions.
Solution Approach 2:
The patent transitions from static heat insulation to dynamic heat control, where heating intensity and insulation levels are continuously adjusted based on real-time temperature, usage scenario, and user proximity. This dynamic approach allows the system to optimize between comfort and safety by adapting to changing conditions rather than maintaining fixed insulation levels.
4Device complexity
If uniform heat dissipation is applied across the terminal, then thermal management is simplified, but localized overheating cannot be effectively addressed
Solution Approach 1:
The patent divides the heating control system into multiple independent regions, each with its own heating elements and control parameters. This segmentation allows targeted heat management for each heat-generating component, addressing localized overheating issues without requiring complex system-wide control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat by insulating or dissipating it according to proximity, preventing overheating, improving user experience, and maintaining performance while ensuring safety.
Implementation Method 1
a heat insulation/dissipation element layer close to a user contact plane, the attribute of which can be converted between heat insulation and heat conduction under electrical control
Implementation Method 2
The distance or distances between the one or more regions of the terminal and the predetermined detection object may be determined based on a change of a numerical value in a proximity sensor
Data Source
AI summary
A heat control method and device are provided. In the method, a distance or distances between one or more regions of a terminal and a predetermined detection object may be detected (S102); heat insulation processing may be performed in a first region of the terminal, where the first region may be a region of which the distance to the predetermined detection object is smaller than a first predetermined threshold; and/or, heat dissipation processing may be performed in a second region of the terminal, where the second region may be a region of which the distance to the predetermined detection object is larger than a second predetermined threshold (S104).