Semiconductor Terminal Hole Locking for Low-Profile Module Assembly
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Solution Overview
Problem
The existing semiconductor devices have limited flexibility in installation due to protruding external connecting terminals, which restricts the placement of insulating sheets and other devices above them, and requires additional space for these terminals.
Innovation Solution
The semiconductor device incorporates conducting boards with terminal holes that allow external connecting terminals to be inserted and locked in place without penetrating through, using lock parts such as stepped portions or projections, enabling secure electrical connection without protrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external connecting terminals are made to protrude from the semiconductor module for electrical connection, then electrical connection is achieved, but the height of the semiconductor device increases and installation flexibility is reduced
Solution Approach 1:
The external connecting terminal is inserted into a terminal hole formed in the conducting board, with the terminal hole penetrating through the conducting board. The terminal hole has a lock part (such as a stepped portion or projection) that prevents the external connecting terminal from protruding through the front surface. This nesting structure allows the terminal to be contained within the device housing while maintaining electrical connection, thereby reducing the overall height and improving installation flexibility.
2Reliability
If external connecting terminals protrude from the semiconductor device, then electrical connection is established, but space must be left above the front surface for the protruding terminals
Solution Approach 1:
The external connecting terminal is nested within the conducting board through the terminal hole structure. The lock part of the terminal hole retains the external connecting terminal inside the conducting board, preventing it from protruding through the front surface. This allows the space above the front surface to be fully utilized for placing insulating sheets, cooling devices, or other components without interference from protruding terminals.
3Reliability
If external connecting terminals protrude from the semiconductor module, then electrical connection is achieved, but installation flexibility is limited due to required clearance space
Solution Approach 1:
The external connecting terminal is contained within the conducting board via the terminal hole with lock part structure, eliminating the need for clearance space above the front surface. This nesting approach allows the semiconductor device to be installed in various configurations and positions, improving adaptability and versatility for different installation environments while maintaining reliable electrical connection.
4Length of stationary object
If external connecting terminals are inserted into terminal holes with lock parts, then the terminals are secured without protrusion, but the terminal hole structure becomes more complex
Solution Approach 1:
The terminal hole is formed with a lock part (stepped portion or projection) at a specific location within the hole to provide retaining function. This localized structural feature adds minimal complexity only where needed for securing the external connecting terminal, while the rest of the terminal hole structure remains simple. The lock part can be formed through conventional machining or molding processes, keeping the overall manufacturing complexity low.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the height of the semiconductor device, enhances space utilization, and allows for more flexible installation options by eliminating the need for additional space above the device, thereby facilitating downsizing and improved assembly.
Implementation Method 1
the second end of which is electrically connected to the conducting board
Data Source
AI summary
A semiconductor device, including a semiconductor module and a conducting board. The semiconductor module includes a semiconductor chip and an external connecting terminal which has a first end electrically connected to the semiconductor chip and a second end extending from the semiconductor chip. The conducting board has a terminal hole penetrating therethrough, an inlet and an outlet of the terminal hole being respectively on two opposite surfaces of the conducting board. The conducting board is electrically connected to the external connecting terminal, of which the second end fits into the terminal hole from the inlet toward the outlet, and is fixed therein by solder. At least one of the terminal hole and the second end of the external connecting terminal has a lock part. The second end of the external connecting terminal, inserted into the terminal hole, is locked by the lock part and thereby remains in the terminal hole.