Semiconductor Terminal Housing Layout for Insulation and Miniaturization
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Solution Overview
Problem
Existing semiconductor devices face challenges in miniaturization due to structural restrictions on terminal position and shape caused by the filling of sealing material, which limits their degree of freedom and can lead to insulation issues and operational failures.
Innovation Solution
The semiconductor device design includes a semiconductor element, substrate, conductor plates, sealing material, terminals, and a housing where the terminals are positioned outside the sealing material, allowing increased freedom in shape and position, and are fixed to the housing to secure insulation distance and positional accuracy, enabling miniaturization without sealing the bonding areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the case is filled with sealing material to maintain insulation distance, then insulation reliability is improved, but the degree of freedom of terminal position and shape is restricted and device miniaturization is hindered
Solution Approach 1:
The patent divides the terminal structure into two parts: the bonding portion (inside sealing material) and the extension portion (outside sealing material). This segmentation allows the bonding area to be sealed for reliability while the extension portion remains free for positioning and connection, resolving the contradiction between insulation reliability and terminal design flexibility.
Solution Approach 2:
The sealing material acts as an intermediary that provides insulation only where needed (at the bonding portion), rather than requiring the entire terminal to be embedded. This allows insulation reliability to be achieved locally without restricting the overall terminal configuration and position.
2Adaptability or versatility
If the terminal is disposed outside the sealing material, then the degree of freedom of position and shape is increased and miniaturization is enabled, but insulation distance maintenance becomes more challenging
Solution Approach 1:
The terminal is segmented into a bonding portion (sealed for insulation) and an extension portion (outside sealing material for flexibility). This allows the device to achieve miniaturization and design freedom through the external extension while maintaining insulation reliability at the critical bonding interface.
Solution Approach 2:
Instead of sealing the entire terminal structure, the patent applies sealing material only to the necessary bonding portion. This partial action approach achieves sufficient insulation for reliability while leaving the extension portion exposed for positional flexibility and miniaturization.
3Reliability
If the bonding area is sealed to ensure reliable bonding, then bonding reliability is improved, but the structural flexibility for miniaturization is reduced
Solution Approach 1:
The patent segments the terminal structure so that only the bonding portion requires sealing for reliable bonding, while the extension portion remains structurally flexible. This segmentation enables miniaturization by reducing the volume of sealed structure while maintaining bonding reliability at the critical interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the degree of freedom in terminal positioning and shape, improves miniaturization, ensures reliable bonding, and prevents insulation failures by maintaining insulation distance and positional accuracy, thus enhancing the semiconductor device's operational reliability.
Implementation Method 1
The sealing material seals the substrate, the semiconductor element, and the conductor plate
Implementation Method 2
The terminal has one end portion bonded to one end portion of the conductor plate outside the sealing material
Implementation Method 3
The housing is fixed to the other end portion side of the terminal with respect to one end portion of the terminal
Data Source
AI summary
A semiconductor device includes a semiconductor element, an insulating substrate on one surface of which the semiconductor element is mounted, a conductor plates electrically connected to the semiconductor element, a sealing material that seals the insulating substrate, the semiconductor element, and the conductor plates such that the other surface of the insulating substrate and one end portion of the conductor plates are exposed, a control terminal and a main terminal each having one end portion bonded to one end portion of the conductor plates outside the sealing material, and a housing fixed to the other end portion side with respect to the one end portion of the control terminal and the main terminal. In the housing, the control terminal and the main terminal are positioned at predetermined positions.