Terminal Module Layout for High-Speed Card Edge Connectors
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Solution Overview
Problem
Card edge connectors face issues with large terminal slots decreasing dielectric constant and long, thin signal terminals leading to high inductive impedance, which are not adequately addressed in high-speed connectors like PCIE 6.0.
Innovation Solution
An electrical connector design featuring an insulating housing with terminal modules composed of conductive and insulating plastics, where grounding terminals are partially retained in conductive plastic and surrounded by insulating plastic, forming a terminal module that enhances signal integrity and reduces resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If large terminal slots are used for assembling terminals, then assembly is easier, but dielectric constant around signal terminals decreases
Solution Approach 1:
The patent applies local quality by using different materials (conductive plastic vs. insulating plastic) in different regions of the terminal module. The conductive plastic is used specifically around grounding terminals to maintain dielectric constant, while insulating plastic is used around signal terminals to reduce inductive impedance. This localized material selection resolves the contradiction by optimizing each region's properties for its specific function.
Solution Approach 2:
The patent employs composite materials by combining conductive plastic and insulating plastic within the same terminal module. The conductive plastic (with higher dielectric constant) is used for grounding terminals, while insulating plastic is used for signal terminals. This composite approach allows simultaneous optimization of signal transmission and grounding functions, resolving the contradiction between assembly ease and signal reliability.
2Volume of moving object
If signal terminals are made long and thin, then space is saved, but inductive impedance increases
Solution Approach 1:
The patent applies local quality by surrounding signal terminals with insulating plastic material. This localized insulation around the long and thin signal terminals reduces their inductive impedance without requiring them to be shorter or thicker, thus maintaining compact size while improving signal transmission reliability.
Solution Approach 2:
The patent changes the dielectric parameters by introducing insulating plastic around signal terminals. This material parameter change reduces the inductive impedance of the long and thin signal terminals, allowing them to maintain their compact dimensions while improving signal transmission performance.
3Reliability
If conductive plastic is used for grounding terminals, then dielectric constant increases, but interference with signal terminals may occur
Solution Approach 1:
The patent applies segmentation by dividing the terminal module into distinct regions: grounding terminals are surrounded by conductive plastic, while signal terminals are surrounded by insulating plastic. This spatial segmentation prevents the conductive plastic from interfering with signal terminals while still providing the dielectric constant benefits for grounding terminals.
Solution Approach 2:
The patent applies local quality by using conductive plastic exclusively around grounding terminals and insulating plastic around signal terminals. This localized material assignment ensures that the high dielectric constant benefit is applied only where needed for grounding, while signal terminals are protected from conductive interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves signal transmission by increasing dielectric constant around signal terminals and reducing the risk of conductive plastic interference, thereby enhancing performance in high-speed applications.
Implementation Method 1
the plurality of grounding terminals are partially retained in the conductive plastic... resulting in increase of dielectric constant around signal terminals
Implementation Method 2
the insulating plastic surrounds and retains the plurality of signal terminals... reducing the risk of conductive plastic interference
Data Source
AI summary
An electrical connector includes: an insulating housing having a mating face, a card slot recessed from the mating face with a floor face facing the mating face, and two side walls located at opposite sides of the card slot; and two terminal modules retained in the insulating housing, each terminal module including a row of terminals, a conductive plastic, and an insulating plastic, the row of terminals including plural signal terminals and plural grounding terminals, wherein the grounding terminals are partially retained in the conductive plastic and the insulating plastic surrounds and retains the signal terminals and the conductive plastic, thereby forming the terminal module.