Terminal Module Pin Layout for High-Speed Connector Upgrades
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Solution Overview
Problem
Current electrical connectors face increased crosstalk issues as bandwidth increases, leading to larger product sizes when trying to accommodate higher transmission rates, requiring redesigns of server or switch panel layouts to maintain compatibility.
Innovation Solution
An electrical connector design that allows for interchangeable terminal modules supporting different signal transmission rates (1G to 40G) without changing the pin size or arrangement, enabling compatibility with the same external circuit board and maintaining consistent dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between two adjacent ports is increased to solve excessive crosstalk, then the crosstalk is reduced, but the product size increases
Solution Approach 1:
The connector is divided into multiple independent layers (first layer and second layer), with each layer containing specific ports. This segmentation allows ports to be arranged in three-dimensional space rather than requiring increased linear distance, thereby reducing crosstalk while maintaining compact product size.
Solution Approach 2:
The patent transitions from a two-dimensional port arrangement to a three-dimensional arrangement by utilizing multiple layers stacked vertically. Ports are distributed across different layers (e.g., first layer and second layer), enabling increased separation between adjacent ports without increasing the horizontal footprint, thus reducing crosstalk while maintaining small product size.
2Speed
If the connector width is increased to increase the transmission rate, then the transmission rate is improved, but the volume increases and redesign of server or switch panel layout is required
Solution Approach 1:
The patent utilizes vertical stacking of multiple layers to accommodate higher transmission rates. By arranging ports across multiple layers (first layer and second layer) rather than expanding horizontally, the connector achieves increased port density and transmission capability while maintaining a compact footprint that fits existing server and switch panel layouts.
Solution Approach 2:
The connector design with multiple layers and specific port arrangements (including USB type-C ports and other communication ports) provides multi-functional capability supporting various transmission rates and protocols. This universal design allows the same connector structure to handle different transmission requirements without increasing volume or requiring redesign of host equipment.
3Speed
If the pin arrangement is changed to support higher signal rates, then the signal transmission capability is improved, but compatibility with existing circuit boards is lost
Solution Approach 1:
The connector is segmented into multiple functional layers with different port types and arrangements. The first layer and second layer can be independently configured to match different circuit board requirements. This segmentation allows the connector to maintain compatibility with existing circuit boards while providing enhanced signal transmission capabilities through additional layers and ports.
Solution Approach 2:
The multi-layer connector design provides universal compatibility by incorporating various port types (USB type-C ports, other communication ports) and flexible arrangements across layers. This allows the same connector structure to adapt to different circuit board configurations and support a range of signal transmission rates without requiring changes to the pin arrangement pattern on the circuit board side.
Data Source
AI summary
An electrical connector for mounting on an external circuit board includes: an insulating body having an upper receiving space and a lower receiving space; a terminal module assembled on the insulating body and including plural pin terminals, each pin terminal having a pin for mounting on the external circuit board, wherein the terminal module is capable of being modified to support 1G or 2.5G or 5G or 10G or 25G or 40G signal transmission while keeping arrangement pattern of the pins unchanged in order to be mounted on the same external circuit board.