Biocompatible Terminal Pin with Noble Metal Coating for IMDs
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Solution Overview
Problem
Existing terminal pins for implantable electromedical devices (IMDs) are costly and require complex assembly processes, leading to increased production costs and potential defects due to the need for separate components and additional assembly steps, which can result in reduced reliability and increased testing efforts.
Innovation Solution
A terminal pin with a thickened section near one end, featuring a soft-solderable noble metal coating, allowing for stable and reproducible connections to a printed circuit board through established soft soldering processes, thereby integrating multiple components into one and reducing assembly complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multi-component terminal pin arrangements are used, then soft-solderability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the terminal pin body and the soft-solderable additional component into a single integrated component. The terminal pin consists of a pin body with an integrated additional component that has a soft-solderable coating, eliminating the need for separate assembly steps and reducing overall device complexity while maintaining ease of manufacture through standard soft-soldering processes
2Ease of manufacture
If separate additional components are added to terminal pins, then soft-solderability is improved, but production cost increases
Solution Approach 1:
The patent integrates the additional soft-solderable component directly onto the pin body as a single manufactured unit rather than assembling separate parts. This integration eliminates the need for additional assembly steps and reduces production costs by streamlining the manufacturing process while maintaining soft-solderability for reliable electrical connections
3Reliability
If separate joining processes are used for additional components, then connection reliability is improved, but assembly time and testing effort increase
Solution Approach 1:
The soft-solderable coating is pre-applied to the additional component during the pin manufacturing process, so that when the terminal pin is assembled to the printed circuit board, the connection is already optimized for reliable soft-soldering. This preliminary preparation eliminates the need for separate joining processes and reduces both assembly time and subsequent testing requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in lower production costs, fewer assembly errors, improved dimensional accuracy, and enhanced reliability of connections, while maintaining compatibility with existing surface-mount technology processes.
Implementation Method 1
at least one part of the surface of the thickened section has a soft-solderable coating comprising a noble metal
Data Source
AI summary
A terminal pin for electrically connecting a conductor support, wherein the terminal pin is provided for the bonded connection to a conducting surface of the conductor support, is formed from a biocompatible non-noble metal, has a section at or near one end that is thickened relative to a section located further from the end, and at least one part of the surface of the thickened section has a soft-solderable coating of a noble metal.