Terminal Plate Inductance Reduction via Segmented Design
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Solution Overview
Problem
Power semiconductor devices experience unexpected vibration in output waveforms due to differences in current path length and inductance, which is exacerbated by the handling of large electric power, leading to instability in operation.
Innovation Solution
A terminal plate design with specific plate portions and connecting portions is implemented to connect semiconductor elements in a state of lower inductance, utilizing a first plate portion connected to a first semiconductor element, a second plate portion connected to a second semiconductor element, and additional plate portions with connecting portions to reduce inductance and absorb thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor elements are connected in parallel using conventional terminal plates, then power handling capability is improved, but inductance increases causing output waveform vibration
Solution Approach 1:
The terminal plate is divided into multiple plate portions (first plate portion, second plate portion, third plate portion, fourth plate portion) that are arranged in a specific configuration. Each plate portion connects to specific semiconductor elements, creating segmented current paths that reduce overall inductance while maintaining power handling capability
Solution Approach 2:
The patent introduces a multi-layered three-dimensional structure with plate portions arranged at different heights and positions. The third and fourth plate portions are positioned above the first and second plate portions respectively, creating vertical current paths that reduce inductance compared to conventional planar connections
2Device complexity
If current path length differences exist in parallel connections, then device complexity is reduced, but operation timing shifts causing vibration
Solution Approach 1:
Each plate portion is specifically designed with optimized dimensions and positioning to create locally balanced current paths. The first and second plate portions have specific width and length dimensions that are optimized to equalize current path lengths to the third and fourth plate portions, ensuring simultaneous operation timing
Solution Approach 2:
The terminal plate structure creates equipotential surfaces through the arranged plate portions, ensuring that all semiconductor elements experience the same electrical potential conditions. This equalizes the current paths and ensures simultaneous switching operation across all parallel-connected elements
3Adaptability or versatility
If thermal expansion differences occur between terminal portions and electrode members, then material selection flexibility is improved, but peeling off occurs reducing reliability
Solution Approach 1:
The terminal plate incorporates a flexible intermediate layer between the terminal portions and electrode members. This flexible layer can accommodate thermal expansion differences through elastic deformation, preventing peeling off while allowing use of different materials for each component
Solution Approach 2:
The patent explicitly addresses thermal expansion by designing the terminal plate structure to accommodate differential thermal expansion between the terminal portions and electrode members. The multi-portion design allows each component to expand at different rates without causing delamination, as the distributed connection points reduce stress concentration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for stable operation by reducing inductance and absorbing thermal expansion differences, thereby minimizing peeling off of terminal portions from electrode members and ensuring reliable power transmission.
Implementation Method 1
In order to stably operate the power semiconductor device, it is preferable to connect a plurality of semiconductor elements in parallel in a state of inductance as low as possible
Implementation Method 2
absorbing thermal expansion differences, thereby minimizing peeling off of terminal portions from electrode members
Data Source
AI summary
Provided is a terminal plate according to an embodiment including: a first plate portion for being connected to a first semiconductor element; a second plate portion for being connected to a second semiconductor element; a third plate portion provided above the first plate portion and the second plate portion; a first connecting portion provided between the first plate portion and the third plate portion and connecting the first plate portion and the third plate portion; a second connecting portion provided between the second plate portion and the third plate portion and connecting the second plate portion and the third plate portion; a fourth plate portion provided above the first plate portion and the second plate portion and provided on the opposite side of the third plate portion with interposing the first and second plate portions; a third connecting portion provided between the first plate portion and the fourth plate portion and connecting the first plate portion and the fourth plate portion; a fourth connecting portion provided between the second plate portion and the fourth plate portion and connecting the second plate portion and the fourth plate portion; and a fifth plate portion provided above the fourth plate portion, the fifth plate portion connected to the fourth plate portion, and the fifth plate portion having a hole.