Terminal Portion Sealing Member for Flexible Display Substrate Bonding
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Solution Overview
Problem
The existing method for manufacturing flexible display devices using resin substrates often results in mounting failures due to stress differences between the resin substrate layers, causing variations in terminal intervals and making it difficult to mount flexible printed circuits.
Innovation Solution
A method involving the formation of a terminal portion sealing member in a frame shape between the element and counter substrates during bonding, which helps to stabilize the terminal group and reduce stress-induced twisting, allowing for successful mounting of FPCs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resin substrate layer is peeled from the support substrate, then the flexible display device structure is achieved, but the end portion of the resin substrate layer is twisted due to stress difference, causing mounting failure
Solution Approach 1:
The terminal portion sealing member is formed in advance to prevent stress-induced twisting of the terminal group. By creating this protective structure before peeling the resin substrate layer from the support substrate, the patent preemptively counteracts the harmful stress differences that would otherwise cause mounting failures.
Solution Approach 2:
The terminal portion sealing member is formed and positioned before the peeling process occurs. This preliminary action ensures that the terminal group is already protected and stabilized with appropriate interval spacing established before stress differences can cause twisting during substrate separation.
2Reliability
If the terminal portion sealing member is formed in a frame shape surrounding the terminal group, then the terminal group stability is improved and mounting failures are suppressed, but the device complexity increases
Solution Approach 1:
The terminal portion sealing member serves multiple functions simultaneously: it seals the terminal group to prevent contamination, provides structural support to maintain terminal interval spacing, and prevents stress-induced twisting during the peeling process. By combining these functions into a single component, the patent avoids the need for multiple separate structures.
Solution Approach 2:
The patent merges the sealing function and the structural support function into a single terminal portion sealing member. This integration reduces the number of separate components needed, thereby limiting the increase in device complexity while still achieving the desired reliability improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses mounting failures by stabilizing the terminal group and reducing stress-induced variations, ensuring reliable attachment of FPCs to the resin substrate layers.
Implementation Method 1
when the support substrate on a side of one of the resin substrate layers is removed, an end portion of the other resin substrate layer is likely to be twisted due to a difference between stress applied to the other resin substrate layer and stress applied to a thin film formed on the other resin substrate layer
Implementation Method 2
bonding the element original substrate to the counter original substrate through an adhesive material layer
Data Source
AI summary
In a substrate bonding step of bonding an element original substrate to a counter original substrate through an intermediate layer so that a thin film element layer and a terminal group formed in the element original substrate face a second resin substrate layer formed in the counter original substrate, to manufacture a substrate bonded body, a terminal portion sealing member is formed in a frame shape surrounding the terminal group between the element original substrate and the counter original substrate.