Terminal Temperature Sensor Integration for Vibration-Stable Thermal Contact

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional temperature sensor assemblies for monitoring terminal temperatures in vehicles face challenges such as complex manufacturing, limited thermal contact, vulnerability to vibrations, and the need for gap fillers that can detach, leading to unreliable thermal readings, especially in high-vibration environments.

Innovation Solution

A terminal assembly with a flexible thermally conductive component, such as liquid silicone rubber, is compressed onto the terminal using a compressing mechanism, embedding a temperature sensor within, which provides a stable thermal path and mechanical stability, eliminating the need for gap fillers and ensuring reliable thermal conductivity even under vibration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermal sensors are used with gap filler, then thermal contact is improved, but manufacturing complexity increases and reliability decreases due to vibration-induced defects

Engineering Contradiction:

Improvethermal contact effectivenessVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent removes the gap filler material from the thermal path between the terminal and temperature sensor. By eliminating this intermediate material, the solution simplifies manufacturing processes and avoids the reliability issues associated with gap filler detachment under vibration, while maintaining effective thermal contact through direct sensor placement on the terminal surface.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The terminal housing serves multiple functions: it provides structural support, electrical insulation, and direct mounting surface for the temperature sensor. This multi-functionality eliminates the need for separate gap filler materials and complex assembly procedures, reducing manufacturing complexity while ensuring reliable thermal contact.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If thermal shunt is used as separate body, then thermal path is established, but device complexity increases due to multiple components

Engineering Contradiction:

Improvethermal path establishmentVSAvoidnumber of components

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the temperature sensor mounting function directly with the terminal housing structure. The sensor is mounted on the terminal housing surface, eliminating the need for separate thermal shunt components. This integration reduces the number of parts while establishing an effective thermal path from the terminal through the housing to the sensor.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If rigid thermal shunt is used, then thermal conductivity is improved, but vibration resistance decreases due to micro cracks in solder joints

Engineering Contradiction:

Improvethermal conductivityVSAvoidvibration resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent uses a flexible or compliant mounting approach where the temperature sensor is directly mounted on the terminal housing surface. This flexible mounting method allows the sensor to maintain thermal contact with the terminal while accommodating vibrations and mechanical stresses, preventing the formation of micro cracks in solder joints that occur with rigid thermal shunt structures.

Inventive Principle:

Principle #30Flexible shells and thin films

4Temperature

If overmolding is used for terminal integration, then thermal contact is improved, but manufacturing difficulty increases for certain terminal shapes

Engineering Contradiction:

Improvethermal contact effectivenessVSAvoidmanufacturing ease

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent removes the overmolding process from the terminal assembly. Instead of embedding the temperature sensor within overmolded terminals, the sensor is mounted on the terminal housing surface. This extraction of the overmolding step simplifies manufacturing, especially for terminals with complex shapes that are difficult to overmold, while maintaining effective thermal contact through direct surface mounting.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures efficient thermal monitoring of terminals with improved vibration resistance, reduced manufacturing costs, and consistent thermal contact without gap fillers, while maintaining the necessary distance between terminals, thus enhancing safety and reliability.

Implementation Method 1

a flexible thermally conductive component (23), a temperature sensor (23c) in contact with the flexible thermally conductive component (23)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a compressing mechanism arranged to compress the flexible thermally conductive component (23)

Methodology Applied

Scientific EffectCompression: Compression

Data Source

PatentEP4063812B1Temperature sensor integration to monitor over-heating of terminals

Publication Date: 2026.05.06 APTIV TECHNOLOGIES AG

Figure 1~2
Figure 3~4
Figure 5~6

AI summary

A terminal assembly (1) having a least one terminal (12, 150), and a thermal sensor system (26) having : - a flexible thermally conductive component (23), - a temperature sensor (23c) in contact with the flexible thermally conductive component (23), wherein the thermal sensor system (26) further having : - a compressing mechanism arranged to compress the flexible thermally conductive component (23).