Terminal Control Substrate With Switchable eSIM Backup Connection
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Solution Overview
Problem
Existing electronic substrates for terminal devices, especially those used in M2M applications, face challenges in replacing or removing IC modules like eSIMs without replacing the entire substrate or device, leading to costly waste when failures occur.
Innovation Solution
A terminal control substrate design that includes a base plate, a control IC, an eSIM, an external connection terminal, and a switching unit, allowing for the connection of a substitute IC module or card, enabling continued operation by switching between the eSIM and the external connection terminal when failures occur.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If IC modules are fixed with solder on the electronic substrate, then the connection reliability is improved, but the replaceability of the IC module deteriorates
Solution Approach 1:
The invention divides the connection system into two segments: a fixed first IC module soldered to the substrate, and a replaceable second IC module connected via a connector. This segmentation allows the first module to provide stable soldered connection while the second module can be easily replaced through the connector interface, resolving the contradiction between connection reliability and replaceability.
Solution Approach 2:
The invention introduces a connector as an intermediary component between the control substrate and the second IC module. This connector acts as a mediator that enables easy plugging and unplugging of the second IC module without requiring soldering operations, thus maintaining replaceability while ensuring reliable electrical connection.
2Reliability
If the entire substrate is replaced when an IC module fails, then the reliability of the terminal device is restored, but the cost and complexity of repair increases
Solution Approach 1:
The invention segments the terminal device into a control substrate portion and IC module portions, where at least the second IC module can be independently replaced. This segmentation allows repair to be limited to replacing only the failed IC module rather than the entire substrate, reducing repair complexity and cost while restoring terminal device operation.
Solution Approach 2:
The invention makes the control substrate universal by designing it to accommodate different IC modules through standardized connectors. The substrate can work with multiple different second IC modules, allowing flexible replacement and repair without requiring a custom substrate for each module type, thereby reducing repair complexity.
3Device complexity
If IC modules are permanently fixed on the substrate, then the device structure is simplified, but the adaptability for module replacement deteriorates
Solution Approach 1:
The invention segments the IC module connection system into a soldered first module and a connector-based second module. This segmentation maintains relatively simple device structure for the fixed first module while providing adaptability for replacing the second module, resolving the contradiction between structural simplicity and replacement capability.
Solution Approach 2:
The invention introduces dynamic replaceability for the second IC module through a connector interface, while keeping the first IC module statically fixed. This dynamic design allows the system to adapt to different operational needs by replacing the second module as required, without significantly complicating the overall device structure.
Data Source
AI summary
According to one embodiment, a terminal control substrate includes a base plate mounted on a terminal device, a first module fixed to the base plate, an external connection terminal fixed to the base plate and to which a component including a second module being a substitute for the first module is attachable, a controller configured to perform control in the terminal device by using the first module or the second module, and a switching unit configured to switch a connection destination of the controller to any one of the first module and the external connection terminal to which the second module is attached.