Terraced Die Support Structure for Stacked Overhang Deflection
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Solution Overview
Problem
Semiconductor die packages with stacked die arrangements experience deflection issues due to overhang portions during manufacturing, leading to quality and reliability problems, increased field failure rates, and increased resource requirements.
Innovation Solution
A terraced support structure is introduced between the overhang portions and the substrate in semiconductor die packages, reducing the likelihood of deflection by providing a compliant material and a profiled terrace system that matches the staggered profile of the overhang portions, thereby enhancing the package's quality and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If stacked die arrangement with overhang portions is used, then manufacturing complexity is reduced, but deflection occurs during manufacturing leading to quality and reliability problems
Solution Approach 1:
A terraced support structure is introduced as an intermediary element between the overhang portions and the substrate. This support structure includes multiple terraces at different heights that provide mechanical support to the overhang portions during manufacturing, preventing deflection while maintaining the stacked die arrangement's manufacturing simplicity.
Solution Approach 2:
The support structure utilizes vertical dimensionality with multiple terraces at different heights to support the overhang portions. By creating a three-dimensional terraced structure rather than a flat support, the patent provides graduated support levels that match the staggered profile of the stacked dies, preventing deflection without adding horizontal manufacturing complexity.
2Device complexity
If stacked die arrangement with overhang portions is used, then resource requirements increase, but manufacturing simplicity is maintained
Solution Approach 1:
The support structure is segmented into multiple terraces at different heights, each supporting specific overhang portions. This segmentation allows the support structure to provide targeted support only where needed, reducing material usage compared to a solid block support while maintaining manufacturing simplicity.
3Reliability
If terraced support structure is added, then deflection is reduced improving quality and reliability, but device complexity increases
Solution Approach 1:
The terraced support structure provides localized support at specific heights and positions corresponding to the overhang portions. Rather than uniformly supporting the entire substrate, the structure applies support only where needed, reducing overall structural complexity while improving package quality by preventing deflection at critical locations.
Data Source
AI summary
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a substrate. The semiconductor device assembly includes a first semiconductor die above the substrate including an edge and a second semiconductor die in a stacked arrangement above the first semiconductor die. The second semiconductor die comprises an overhang portion extending beyond the edge. The semiconductor device assembly includes a terraced support structure between the overhang portion and the substrate. The terraced support structure may mitigate deflection of the overhang portion during a molding operation to prevent damage to the semiconductor device assembly.