Electronic Device Test Apparatus Calibration Using Image Processing
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Solution Overview
Problem
Existing electronic device test apparatuses face challenges in calibrating the relative position of image capturing means with respect to sockets after changing IC device types, requiring manual and time-consuming processes that are prone to errors due to thermal stress and vibration, leading to potential miscontact between IC devices and sockets.
Innovation Solution
A calibration method using a calibration jig placed at a predetermined position, with image capturing means recognizing and calculating offset amounts to align the image capturing devices relative to the socket, allowing for automated precision calibration independent of device type and temperature changes, and correcting for thermal expansion and vibration-induced offsets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual calibration method is used to position image capturing means relative to sockets after changing IC device types, then calibration can be performed, but calibration time is excessively long (hours) and prone to errors due to thermal stress and vibration
Solution Approach 1:
The patent replaces manual mechanical calibration operations with an automated image processing system. The socket image capturing means captures images of sockets, the device image capturing means captures images of calibration jigs, and image processing automatically calculates positional relationships and generates correction data, eliminating manual intervention and significantly reducing calibration time while maintaining high precision
Solution Approach 2:
The system performs self-calibration by automatically capturing images, processing data, calculating positional offsets, and generating correction information without requiring external manual operations. The calibration process is autonomously executed by the test apparatus itself, reducing both time and human error
2Adaptability or versatility
If manual calibration is performed after temperature changes, then calibration can be completed, but thermal expansion and vibration cause positioning errors requiring repeated adjustments
Solution Approach 1:
The patent applies preliminary anti-action by capturing images and calculating positional relationships at a reference temperature state before thermal stress occurs. Correction data is pre-calculated and stored, then applied during actual testing to compensate for thermal expansion and vibration effects, preventing positioning errors rather than correcting them after they occur
Solution Approach 2:
The system replaces manual trial-and-error adjustment operations with automated image-based measurement and calculation. The image processing system objectively determines positional relationships and generates precise correction data, eliminating subjective manual adjustments and achieving consistent precision across different temperature conditions
3Measurement precision
If dedicated calibration procedures are implemented for each IC device type change, then calibration accuracy can be maintained, but device complexity and operational difficulty increase
Solution Approach 1:
The patent implements a universal calibration method using standardized calibration jigs and a unified image processing algorithm that works across different IC device types. The same basic procedure and equipment are used regardless of device type, with the system automatically adapting through image recognition and calculation, eliminating the need for type-specific calibration procedures
Solution Approach 2:
The calibration jig serves as an intermediary object that facilitates automated image-based calibration. By placing known reference markers on the jig, the system can automatically detect positional relationships between image capturing means and sockets through image processing, simplifying the calibration procedure while maintaining accuracy
4Measurement precision
If frequent calibration is performed to account for thermal stress and vibration, then positioning accuracy improves, but productivity decreases due to time loss
Solution Approach 1:
The patent performs calibration in advance at a reference temperature state before actual testing begins. The correction data calculated from preliminary calibration is stored and automatically applied during testing, eliminating the need for frequent re-calibration and allowing continuous high-speed testing while maintaining positioning accuracy
Solution Approach 2:
The automated image processing system rapidly captures images and calculates positional relationships in seconds, replacing time-consuming manual calibration operations. This enables frequent calibration when necessary without significantly impacting productivity, as the automated system completes calibration tasks much faster than manual methods
Data Source
AI summary
In an electronic device test apparatus using image processing technology to position an IC device relative to a socket, a calibration method of an electronic device test apparatus of calibrating a relative position of a device camera with respect to a socket, the method comprising: calculating an offset amount of a socket guide with respect to the socket on the basis of a relative position of the socket camera with respect to the socket guide and a relative position of a socket camera with respect to the socket; and adding this offset amount to the relative position of the device camera with respect to the socket guide so as to calculate the relative position of the device camera with respect to the socket.