Test Apparatus Probe Circuit Physical Separation
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Solution Overview
Problem
In chip testing apparatuses, the high component density on circuit boards leads to interference and necessitates the replacement of the entire apparatus when a single circuit is damaged, resulting in high testing costs.
Innovation Solution
The peripheral circuit and special function circuit are physically separated onto different circuit boards, with probe pins arranged in distinct circles to prevent interference and allow for selective replacement of damaged boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the peripheral circuit and the circuit of special function are arranged on the same circuit board, then the component density is high and the apparatus structure is compact, but interference between components occurs and the entire apparatus must be replaced when one circuit is damaged
Solution Approach 1:
The patent divides the circuit board into multiple independent circuit boards, each carrying specific circuits. The peripheral circuit and the circuit of special function are arranged on different circuit boards, achieving physical separation. This segmentation reduces component density on each board, minimizes interference between components, and allows independent replacement of damaged circuit boards without replacing the entire apparatus.
2Device complexity
If the peripheral circuit and the circuit of special function are arranged on the same circuit board, then the apparatus structure is compact, but the entire apparatus must be discarded when one circuit is damaged, leading to high testing costs
Solution Approach 1:
The patent segments the apparatus into multiple independent circuit boards that can be separately replaced. When one circuit board is damaged, only that specific board needs to be replaced rather than the entire apparatus, significantly reducing repair costs and improving ease of maintenance.
Solution Approach 2:
The patent enables selective replacement of damaged circuit boards while retaining functional boards. This approach recovers usable components and circuits from the system, reducing waste and lowering the overall cost of ownership by avoiding complete apparatus replacement.
3Area of moving object
If all probes are arranged in the same circle with small gaps, then the probe arrangement is compact, but interference between probes is likely to occur
Solution Approach 1:
The patent divides the probes into different groups and arranges them on different circuit boards. This spatial segmentation increases the distance between probes, reduces electromagnetic interference between adjacent probes, and maintains a compact overall apparatus structure by distributing probes across multiple boards rather than crowding them on a single board.
Data Source
AI summary
A test apparatus with physical separation feature is disclosed. The test apparatus includes probes (210), a peripheral circuit (220), a circuit of special function (230), wherein the peripheral circuit and the circuit of special function are separately arranged on different circuit boards (240, 250). The peripheral circuit and the circuit of special function are both electrically connected to the probes. In the test apparatus with physical separation feature, the peripheral circuit and the circuit of special function are separated in physical spaces, so that interference between the components is prevented and the testing cost is reduced.


