Test Board Thermal Conditioning via Inverted Biasing
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Solution Overview
Problem
Existing test boards for electronic devices suffer from non-uniform temperature distribution and mechanical stress issues during thermal conditioning, leading to potential damage and inefficiencies in the testing process.
Innovation Solution
A test board design featuring sockets with integrated thermal conditioning elements and biasing structures that can switch between active and passive conditions, ensuring effective thermal and mechanical coupling with electronic devices while allowing for easy insertion and removal, and enabling automatic loading/unloading processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the conditioning element is placed on top of the electronic device, then the local thermal conditioning is achieved, but the electronic device is almost totally shielded from the hot/cold air causing non-uniform temperature distribution and potential damage to terminals
Solution Approach 1:
The patent inverts the conventional placement of the conditioning element from above the electronic device to below it, directly against the package substrate. This inversion allows the conditioning element to thermal couple with the package without shielding the device from environmental air flow, thereby achieving uniform temperature distribution while preventing terminal overheating and socket damage.
Solution Approach 2:
The patent introduces a thermal interface material or thermal pad as an intermediary between the conditioning element and the electronic device package. This intermediary ensures efficient thermal coupling while allowing the conditioning element to be positioned below the device, enabling uniform heat distribution without direct mechanical contact that could cause damage to the socket or device terminals.
2Ease of operation
If the conditioning element is placed on top of the electronic device, then local thermal conditioning is achieved, but the electronic device requires manual insertion and removal from the socket
Solution Approach 1:
By inverting the conditioning element placement to below the electronic device, the socket structure is simplified and automated insertion mechanisms can effectively engage with the device. The conditioning element remains in place while the device is automatically inserted and removed from the socket, eliminating manual handling and improving test process efficiency.
3Adaptability or versatility
If global thermal conditioning is applied through hot/cold air, then all electronic devices are conditioned, but the temperature distribution throughout the different electronic devices is not uniform
Solution Approach 1:
The patent segments the thermal conditioning system into two parts: a global conditioning system that provides overall thermal environment through hot/cold air circulation, and local conditioning elements positioned below each electronic device that provide precise thermal control. This segmentation allows both broad coverage and uniform local temperature distribution to be achieved simultaneously.
Solution Approach 2:
The patent applies local quality by positioning thermal conditioning elements directly beneath each electronic device, tailored to the specific thermal requirements of each device. This local conditioning approach ensures uniform temperature distribution across all devices while the global system maintains overall thermal environment control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the thermal and mechanical performance of the test process, reducing the risk of damage to test boards and improving the efficiency of electronic device testing by ensuring uniform temperature distribution and minimizing mechanical stress.
Implementation Method 1
a thermal conditioning element for acting on the main surface of the electronic device
Implementation Method 2
biasing means switchable between an active condition and a passive condition, wherein in the active condition the biasing means biases the thermal conditioning element in contact with the main surface of the electronic device
Data Source
Figure 1
Figure 2A~2C
Figure 2D
AI summary
A solution for testing a set of one or more electronic device (105) is disclosed. A corresponding test board (100) comprises a support substrate (205), a set of one of more sockets (210) being mounted on the support substrate each one for housing an electronic device (105) to be tested with a main surface thereof facing the support substrate, for each socket a thermal conditioning element (235) for acting on the main surface of the electronic device, and for each socket biasing means (240) being switchable between an active condition, wherein the biasing means biases the thermal conditioning element in contact with the main surface of the electronic device, and a passive condition, wherein the biasing means maintains the thermal conditioning element separate from the main surface of the electronic device.