Test Board Local Thermal Conditioning via Inverted Biasing
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Solution Overview
Problem
Existing test methods for electronic devices at the package level face issues with non-uniform temperature distribution and mechanical stress, leading to potential damage and inefficiencies in the testing process due to inadequate thermal and mechanical coupling between the devices and conditioning elements.
Innovation Solution
A test board design featuring sockets with integrated thermal conditioning elements and a biasing structure that can switch between active and passive conditions, allowing for improved thermal and mechanical coupling by adjusting the position and pressure of the heater relative to the electronic device, thereby enhancing the assembly and reducing manual handling and damage risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the conditioning element is placed on top of the electronic device to provide local thermal conditioning, then the thermal conditioning effect is improved, but the terminals reach significantly higher temperatures causing metal migration and micro-welding phenomena that deteriorate or damage the socket
Solution Approach 1:
The patent inverts the conventional placement of the thermal conditioning element from the top surface to the bottom surface of the socket. This inversion allows the heating element to thermally condition the electronic device through the socket structure without directly heating the terminals, thereby preventing metal migration and micro-welding while maintaining effective thermal conditioning of the device body.
Solution Approach 2:
The patent introduces the socket as an intermediary structure between the thermal conditioning element and the electronic device terminals. The socket acts as a thermal mediator that allows heat transfer to the device body while protecting the terminals from excessive temperature exposure, thus preventing harmful thermal effects on the electrical connections.
2Temperature
If the conditioning element is placed on top of the electronic device, then local thermal conditioning is achieved, but the electronic device must be manually inserted and removed from the socket, reducing test process efficiency
Solution Approach 1:
By inverting the thermal conditioning element placement to the bottom of the socket, the patent enables automated insertion and removal of electronic devices without manual intervention. The thermal conditioning function is maintained through the socket structure, allowing standard automated handling mechanisms to be used, thereby significantly improving test process efficiency and productivity.
3Area of stationary object
If global hot or cold air conditioning is used to thermal condition all electronic devices, then the conditioning coverage is improved, but the temperature distribution throughout the different electronic devices is not uniform
Solution Approach 1:
The patent segments the thermal conditioning system from a single global source into multiple distributed local sources, with each socket equipped with its own thermal conditioning element. This segmentation enables independent temperature control for each electronic device, achieving uniform temperature distribution across all devices while maintaining comprehensive coverage.
Solution Approach 2:
The patent applies local quality by providing customized thermal conditioning at each socket location rather than using a uniform global approach. Each thermal conditioning element can be independently controlled to match the specific thermal requirements of the electronic device in that position, ensuring optimal temperature uniformity across the entire array of devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the thermal and mechanical coupling of electronic devices during testing, reducing the risk of damage and enabling more efficient and automated loading/unloading processes, while maintaining effective thermal conditioning without interfering with device insertion or removal.
Implementation Method 1
a conditioning element may be provided for each socket, so as to heat or cool the corresponding electronic device locally
Implementation Method 2
hot or cold air is forced towards them in order to heat or cool, respectively, all the electronic devices mounted thereon
Implementation Method 3
biasing means that may be switched between an active condition and a passive condition
Data Source
AI summary
A solution for testing a set of one or more electronic device (105) is disclosed. A corresponding test board (100) comprises a support substrate (205), a set of one of more sockets (210) being mounted on the support substrate each one for housing an electronic device (105) to be tested with a main surface thereof facing the support substrate, for each socket a thermal conditioning element (235) for acting on the main surface of the electronic device, and for each socket biasing means (240) being switchable between an active condition, wherein the biasing means biases the thermal conditioning element in contact with the main surface of the electronic device, and a passive condition, wherein the biasing means maintains the thermal conditioning element separate from the main surface of the electronic device.