Semiconductor Package Test Board Temperature Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor package testing systems lack accuracy due to temperature discrepancies between testing conditions and actual usage conditions, leading to unreliable results.
Innovation Solution
A semiconductor package test apparatus featuring a handler with a heating and cooling unit, a test board with a main socket and a base board, and a board temperature controller with separate heating and cooling modules to maintain consistent temperatures, ensuring accurate testing by controlling the temperature of both the semiconductor package and the test board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor packages are tested at standard temperatures without active temperature control, then the testing system is simpler and easier to operate, but the reliability of testing results deteriorates because temperature discrepancies exist between testing conditions and actual usage conditions
Solution Approach 1:
The temperature control system is segmented into two independent control units: a first heater/cooler for controlling the semiconductor package temperature and a second heater/cooler for controlling the test board temperature. This segmentation allows each unit to independently maintain its designated temperature, ensuring reliable testing results while keeping each control unit relatively simple in design
Solution Approach 2:
The test board serves as an intermediary thermal element between the semiconductor package and the external environment. By equipping the test board with its own heater/cooler unit, the system creates a controlled thermal intermediary that can actively compensate for temperature variations, thereby improving testing reliability without requiring complex external temperature control mechanisms
2Temperature
If the test board is integrated closely with the semiconductor package, then the thermal coupling is better and temperature control is easier, but the heat dissipation path is restricted and temperature management becomes difficult
Solution Approach 1:
The test board is segmented into a main test board and a base test board spaced apart from each other. This spatial segmentation creates an intermediate thermal zone that facilitates heat dissipation while maintaining sufficient thermal coupling for effective temperature control. The spacing between the two boards allows heat to dissipate vertically without restricting the horizontal thermal coupling needed for control
Solution Approach 2:
The dual-board configuration utilizes the vertical dimension for heat dissipation while maintaining horizontal thermal coupling. By spacing the main test board and base test board vertically, the system creates a three-dimensional thermal management structure that simultaneously achieves good thermal coupling (for control accuracy) and effective heat dissipation (through vertical airflow and radiation paths)
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures that the semiconductor package is tested at precise temperatures matching expected conditions, enhancing the reliability of the testing results by maintaining set temperatures and offsetting temperature changes during testing.
Implementation Method 1
a handler including a first heater and cooler to heat and cool a semiconductor package
Implementation Method 2
a handler including a first heater and cooler to heat and cool a semiconductor package
Implementation Method 3
a board temperature controller including a second heater and cooler to heat and cool the main test board
Implementation Method 4
a board temperature controller including a second heater and cooler to heat and cool the main test board
Data Source
AI summary
A semiconductor package test apparatus includes a handler, a test board, and a board temperature controller. The handler includes a first heater and cooler to heat and cool a semiconductor package. The test board tests the semiconductor package, and includes main test board having a test socket and a base test board spaced from the main test board. The board temperature controller includes a second heater and cooler to heat and cool the main test board.