Reconfigurable Test Board for eMMC and UFS Terminal Mapping
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Solution Overview
Problem
Existing test boards struggle to accommodate different terminal functions between semiconductor devices like eMMC and UFS, making it difficult to use a common board for testing due to varying terminal assignments for voltage and signal supply.
Innovation Solution
A test board design that allows adjustable connection of circuit elements to terminals based on the type of semiconductor device, using jumper switches and multiple current paths to accommodate different terminal functions, enabling flexible testing of eMMC and UFS.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a common test board is used for both eMMC and UFS semiconductor devices, then device compatibility is improved, but terminal function assignment conflicts arise due to different terminal definitions between device types
Solution Approach 1:
The test board employs jumper switches that can be dynamically configured to change terminal function assignments based on the semiconductor device type being tested. This dynamic reconfiguration allows the same physical board to adapt between eMMC and UFS testing by switching circuit connections, resolving the terminal function conflict while maintaining device compatibility
Solution Approach 2:
The invention changes the electrical connection parameters of the test board by providing multiple current paths with different circuit elements (resistors, capacitors, inductors) that can be selectively activated. By changing which current path is connected through jumper switches, the board adapts its electrical characteristics to match the requirements of different semiconductor device types
2Adaptability or versatility
If different current paths with different circuit elements are provided for terminal connections, then testing flexibility for different device types is improved, but board structure complexity increases
Solution Approach 1:
The test board structure is segmented into multiple independent current paths, each containing specific circuit elements suitable for different testing scenarios. This segmentation allows selective activation of only the required current path for each device type, providing testing flexibility while managing board structure complexity through modular organization
Solution Approach 2:
The test board achieves multi-functionality by integrating multiple current paths with different circuit elements (resistive, capacitive, inductive) into a single board structure. The jumper switch system provides universal control over which current path is active, allowing one board to perform multiple testing functions for different semiconductor device types
Data Source
AI summary
A test board includes a substrate, a socket mounted on the substrate and including a first connector pin to be connected to a first terminal of a semiconductor device when the semiconductor device is mounted in the socket, a plurality of external terminals through which a voltage or a signal is supplied to the first connector, first and second current paths that can be electrically connected between the first connector pin and one of the plurality of external terminals, and a connection mechanism. The first current path includes a first circuit element. The second current path includes no circuit element or a second circuit element that is different from the first circuit element. The connection mechanism is capable of electrically connecting the first connector pin to one of the plurality of external terminals via one of the first current path and the second current path.