Test Board Unit Thermal Management for Semiconductor Burn-In
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Solution Overview
Problem
The existing test board systems for semiconductor chips face reliability issues due to temperature differences between the central and edge portions during burn-in tests, leading to inconsistent test results.
Innovation Solution
A test board unit is designed with a thermal tank and a heat-dissipating plate or via to efficiently dissipate heat generated by the semiconductor chip, ensuring uniform temperature distribution by transferring heat through electrical signal paths and improving heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional test board is used for burn-in testing, then the semiconductor chip can be tested at elevated temperatures, but temperature difference between central and edge portions causes unreliable test results
Solution Approach 1:
The test board is divided into multiple independent heating zones with separate heating elements, allowing each zone to be controlled independently to achieve uniform temperature distribution across the entire board surface
Solution Approach 2:
The heating control system dynamically adjusts heating parameters (power, duration) for different zones based on real-time temperature feedback, changing operational parameters to maintain temperature uniformity during burn-in testing
2Temperature
If heat dissipation structures are added to the test board, then temperature uniformity can be improved, but device complexity increases
Solution Approach 1:
A thermal coupling plate is introduced as an intermediary component between the heating elements and the semiconductor chip, serving as a heat distribution medium that simplifies the overall thermal management structure while achieving uniform temperature
Solution Approach 2:
The thermal coupling plate serves multiple functions simultaneously: it acts as a heat distribution medium, provides mechanical support for the chip, and facilitates thermal contact, thereby reducing the need for separate components and simplifying the overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal resistance, achieves uniform heat distribution, and enhances the reliability of test results by rapidly dissipating heat, thereby maintaining a consistent temperature across the test board.
Implementation Method 1
The heat-dissipating plate may be coupled between the test board and the thermal tank and may be configured to transfer the heat from the semiconductor chip to the thermal tank
Implementation Method 2
The thermal tank may be configured to dissipate heat generated in the semiconductor chip
Implementation Method 3
The heat-dissipating via may be formed in the test board to electrically couple the semiconductor chip with the thermal tank
Data Source
AI summary
A test board unit may include a test board, a thermal tank and a heat-dissipating plate. The test board may be configured to provide a semiconductor chip with a test current. The thermal tank may be configured to dissipate heat generated in the semiconductor chip. The heat-dissipating plate may be coupled between the test board and the thermal tank and may be configured to transfer the heat from the semiconductor chip to the thermal tank.