High-Throughput Test Chip Valve Layout for Contamination Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing digital PCR (dPCR) technologies face challenges in flexibility and accuracy due to contamination risks from idle chambers and complex liquid handling processes, which affect the throughput and reliability of DNA quantification.

Innovation Solution

A high-throughput test chip design featuring a backplane and cover plate with adjustable valve structures for pipeline control, allowing selective use of accommodation chambers and flexible liquid handling, combined with air valve systems for chamber separation and contamination prevention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple accommodation chambers are used to increase test throughput, then productivity is improved, but the risk of contamination from idle chambers increases, worsening reliability

Engineering Contradiction:
Improvetest throughputVSAvoidcontamination risk
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system divides the liquid handling pathways into separate, isolated pipelines for each accommodation chamber. Each chamber has its dedicated liquid inlet and outlet connections, preventing cross-contamination between chambers while allowing simultaneous operation of multiple chambers to maintain high throughput

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system employs dynamically controllable valve structures that can selectively open or close pipeline connections based on the operational status of each accommodation chamber. This dynamic control allows the system to adapt to different testing scenarios, isolating idle chambers from the liquid handling system to prevent contamination while keeping active chambers operational

Inventive Principle:
Principle #15Dynamics

2Reliability

If valve structures are added to control pipeline connection for each chamber, then reliability is improved by preventing contamination, but device complexity increases

Engineering Contradiction:
Improvecontamination preventionVSAvoidpipeline control structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The valve control system is segmented into individual valve structures associated with each accommodation chamber or pipeline group. This modular approach allows independent control of each chamber's liquid handling pathway, simplifying the overall control architecture while maintaining reliable contamination prevention through localized valve actuation

Inventive Principle:
Principle #1Segmentation

3Object-affected harmful factors

If separate pipelines are provided for each accommodation chamber, then contamination risk is reduced, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvecontamination riskVSAvoidpipeline configuration
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The backplane and cover plate are designed as universal components that can accommodate multiple different chamber configurations and testing scenarios. The standardized pipeline interfaces and valve mounting structures allow the same base architecture to support various pipeline arrangements, reducing manufacturing complexity while maintaining contamination prevention through separate pathways

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The pipeline system is segmented into modular units that can be independently manufactured and then assembled into the complete liquid handling system. This modular pipeline design simplifies manufacturing by allowing specialized fabrication of individual pipeline segments with integrated valve structures, which are then connected to form the complete contamination-resistant liquid handling network

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20260084147A1High-throughput test chip
Publication Date: 2026.03.26 BEIJING BOE TECH DEV CO LTD
  • US20260084147A1 patent drawing
  • US20260084147A1 patent drawing
  • US20260084147A1 patent drawing

AI summary

A high-throughput test chip includes: a backplane, a cover plate and a connector. The backplane and the cover plate are aligned to form a plurality of accommodation chambers. Test chip units are disposed on one side of the backplane facing the cover plate, and each of the test chip units is located in the corresponding accommodation chamber. Each of the accommodation chambers is provided with a liquid inlet and a liquid outlet. The connector includes pipelines; each of the pipelines is provided with a valve structure configured to control connection or disconnection of the pipeline. In each pair of a pipeline and an accommodation chamber, an inlet of the pipeline communicates with the liquid outlet of the accommodation chamber; the pipelines form at least one pipeline group, each pipeline group at least includes two pipelines, and the pipelines in each pipeline group share the same sample liquid outlet.