Test Circuit Digital Control Analog Inspection Area
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Solution Overview
Problem
The increasing complexity and miniaturization of semiconductor devices lead to difficulties in accurately aligning probe pins with input/output pads on wafers, resulting in prolonged inspection times and reduced productivity due to the limited mounting area and increased complexity of probe cards.
Innovation Solution
A test circuit is designed with separate digital control and analog inspection circuits, where the digital control circuit decodes commands, selects and controls analog inspection circuits, and is located apart from them, allowing for efficient use of mounting area and reduced signal line complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of power switch ICs and signal switch ICs is increased to accommodate more DUTs on a single wafer, then the inspection time is reduced, but the available mounting area decreases and the board complexity increases
Solution Approach 1:
The probe card is divided into multiple regions with each region containing a subset of switch ICs and corresponding signal lines. This segmentation allows the board to handle more DUTs by distributing components across regions, reducing the complexity within each region while maintaining the capability to test multiple devices simultaneously.
Solution Approach 2:
The switch ICs are designed with multi-functional capabilities to handle both power switching and signal routing functions. This universality reduces the total number of separate ICs needed, thereby reducing mounting area and board complexity while still supporting inspection of multiple DUTs.
2Productivity
If the number of power switch ICs and signal switch ICs is increased to accommodate more DUTs on a single wafer, then the inspection time is reduced, but the available mounting area decreases
Solution Approach 1:
Multiple switch ICs are integrated into a single integrated circuit module that combines power switching and signal switching functions. This merging reduces the total number of separate components that need to be mounted, thereby increasing the available mounting area while still supporting the inspection of multiple DUTs.
Solution Approach 2:
The probe card structure employs a nested arrangement where multiple layers of signal lines and switch ICs are stacked vertically. This nesting approach allows more functional elements to be packed into a smaller planar area, effectively increasing the mounting area available for additional DUTs.
3Adaptability or versatility
If the number of signal lines for control of switch ICs is increased, then the number of switch ICs that can be controlled increases, but the complexity of probe card board increases and design time increases
Solution Approach 1:
A digital control circuit is introduced as an intermediary between the control system and the switch ICs. This digital control circuit receives digital commands and automatically translates them into the appropriate control signals for multiple switch ICs, reducing the need for numerous direct control lines and simplifying the board design.
Solution Approach 2:
The control system is transitioned from a direct electrical connection approach to a digital command-based approach. Instead of using numerous physical control lines, the system uses digital commands that are processed by the digital control circuit, which then generates the necessary control signals, thereby reducing board complexity and design time.
4Adaptability or versatility
If the number of signal lines for control of switch ICs is increased, then the number of switch ICs that can be controlled increases, but the design time increases
Solution Approach 1:
The digital control circuit is designed with self-configuring capabilities that automatically generate appropriate control signals based on digital commands received. This self-service approach eliminates the need for manual design and configuration of numerous control lines, significantly reducing design time while maintaining the ability to control multiple switch ICs.
Data Source
AI summary
Provided is a test circuit configured to receive an inspection command from automatic test equipment (ATE) and test a device under test (DUT), and the test circuit includes a plurality of analog inspection circuits electrically connected to the DUT to test an operation thereof, and a digital control circuit configured to control operations of the analog inspection circuits, wherein the digital control circuit and the analog inspection circuits are located apart from each other.


