Test Contact Receptacle Positioning Unit for Semiconductor Testing
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Solution Overview
Problem
Existing devices for handling test contacts require specific designs for each geometrically deviating contact, limiting their universal applicability and precision in alignment and contacting due to high concentration and short distances between contacts.
Innovation Solution
A device with a test contact receptacle featuring a positioning unit having multiple surfaces, including a base contact surface and edge contact surfaces disposed at a predetermined angle, allowing precise and directed arrangement of test contacts, enabling universal use across different designs without height or width limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a negative pressure is applied to the test contact for mounting and handling, then the test contact can be securely held, but the alignment precision and contacting reliability are insufficient due to lack of positioning surfaces
Solution Approach 1:
The contact head is divided into functional zones: a negative pressure generation zone for secure mounting, and a positioning unit with multiple positioning surfaces (first positioning surface, second positioning surface, and third positioning surface) for precise alignment. This segmentation allows each zone to perform its specific function optimally without interfering with the other.
Solution Approach 2:
The positioning unit acts as an intermediary between the negative pressure mounting mechanism and the test contact. It provides mechanical contact surfaces that mediate the alignment process, ensuring the test contact is precisely positioned before the negative pressure is applied for secure holding.
2Manufacturing precision
If a stop is used to align the test contact by contacting the top edge, then alignment is achieved, but the device must be redesigned for each geometrically deviating test contact
Solution Approach 1:
The positioning unit is designed with multiple positioning surfaces that can accommodate different test contact geometries. The first positioning surface contacts the top edge, the second positioning surface contacts the side edge, and the third positioning surface contacts the bottom edge. This multi-functional positioning system allows the same device to precisely align various test contact designs without redesign.
Solution Approach 2:
Instead of relying solely on vertical alignment (single dimension) with a top-edge stop, the invention introduces positioning surfaces in multiple dimensions: vertical (first positioning surface), horizontal (second positioning surface), and bottom support (third positioning surface). This multi-dimensional positioning approach enables universal adaptability to different test contact geometries.
3Productivity
If test contacts are disposed with high concentration on a test board, then the testing capacity is increased, but the alignment and contacting requirements become more stringent
Solution Approach 1:
The positioning unit segments the alignment function into multiple independent surfaces, each responsible for a specific degree of freedom. This segmentation allows precise control of test contact position even when test contacts are densely arranged, maintaining high contacting precision despite increased testing capacity.
Solution Approach 2:
The invention replaces reliance on operator skill or simple mechanical stops with a structured system of multiple positioning surfaces that passively enforce precise alignment through geometric constraints. This mechanical system automatically ensures high positioning precision required for densely packed test contacts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise, reliable, and stable handling of various test contacts by disabling movement in multiple directions, allowing for exact positioning and secure mounting using negative pressure, thus overcoming the limitations of existing devices.
Implementation Method 1
a positioning unit (18) having at least two, preferably three, positioning surfaces (20, 22, 24) for coming into positioning contact with a test contact (100) and for positioning the test contact (100) relative to the contact end (16) of the contact head (12)
Implementation Method 2
devices for manufacturing a test contact arrangement are known, whose test contact receptacle applies a negative pressure to the test contact for mounting and handling
Data Source
AI summary
A device for handling a test contact in which the device includes a contact head provided with a test contact receptacle at its contact end, the test contact receptacle having a positioning unit having at least two, preferably three, positioning surfaces for coming into positioning contact with a test contact and for positioning the test contact relative to the contact end of the contact head. The at least one positioning surface of the positioning unit being formed as a base contact surface and at least one more positioning surface of the positioning unit being formed as an edge contact surface. Furthermore, a manufacturing system is also provided for manufacturing a test contact arrangement for testing semiconductor components.