Semiconductor Test Device Temperature Control Module
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Solution Overview
Problem
The burn-in test for semiconductor devices faces challenges due to non-uniform temperature distribution within the burn-in chamber, leading to low accuracy and reliability in testing semiconductor devices.
Innovation Solution
A semiconductor test device with a chamber, slots, and temperature control modules is introduced, where temperature control modules with inflow and outflow units maintain a consistent temperature across the chamber by mixing and controlling air flow to ensure uniform temperature distribution, thereby ensuring accurate testing of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor devices are tested simultaneously in a burn-in chamber, then productivity is improved, but temperature uniformity deteriorates leading to low testing accuracy
Solution Approach 1:
The burn-in chamber is divided into multiple zones with independent temperature control. Each zone contains heating units and air circulation systems that can be controlled separately, allowing simultaneous testing of multiple semiconductor devices while maintaining uniform temperature distribution in each zone.
Solution Approach 2:
Different regions of the burn-in chamber are equipped with localized temperature control mechanisms. Heating units are distributed throughout the chamber, and air circulation paths are designed to create localized uniform temperature zones, ensuring that each testing area maintains the required temperature uniformity regardless of the number of devices being tested.
2Temperature
If heating units are added to improve temperature uniformity, then temperature distribution is improved, but device complexity increases
Solution Approach 1:
The air circulation system serves multiple functions: it distributes heated air uniformly throughout the chamber, removes heat from devices being tested, and enables temperature control in multiple zones simultaneously. This multi-functionality reduces the need for separate heating and cooling systems, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent uses air circulation as a pneumatic system to achieve temperature uniformity. Fans and air ducts are used to circulate heated air throughout the chamber, providing uniform temperature distribution without requiring complex contact-based heating systems. This approach maintains relatively simple chamber structure while improving temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent temperature distribution within the chamber, enhancing the accuracy and reliability of semiconductor device testing by maintaining set temperatures across different regions, thereby improving the testing process.
Implementation Method 1
The middle region may have a hollow shape to mix the air introduced by the inflow units
Implementation Method 2
The temperature control module may control the inflow units and the outflow units to provide the semiconductor devices with the set temperature
Data Source
AI summary
A semiconductor test device may include a chamber, a plurality of slots, a plurality of test boards and a plurality of temperature control modules. The slots may be arranged in the chamber. The test boards may be inserted into a part of the slots. The test boards may be configured to receive a plurality of semiconductor devices. The temperature control modules and the test boards may be alternately inserted into other parts of the slots. The temperature control modules may be configured to provide each of the test boards with air having a set temperature.