Test Diode Interconnect Structure for Real-Time Bond Defect Detection
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Solution Overview
Problem
Current semiconductor device manufacturing methods face challenges in rapidly detecting shorts and opens during the bonding process, leading to delayed feedback and prolonged production timelines due to the lack of real-time verification capabilities for inter-die connections.
Innovation Solution
A connection structure with test diode circuits and non-releasable interconnections is integrated into the semiconductor device to enable real-time detection of defects, allowing for immediate process adjustments and feedback during the Thermo Compression bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If 2D or 3D X-ray methods are used to analyze inter-die connections, then measurement precision is improved, but loss of time increases significantly
Solution Approach 1:
The patent replaces physical/mechanical inspection methods (X-ray, cross-sectioning) with electrical measurement methods. Test diode circuits electrically connected through non-releasable interconnections allow defect detection through electrical characteristics, eliminating the need for time-consuming physical imaging and sectioning while maintaining detection capability.
Solution Approach 2:
The test diode circuits are integrated directly into the semiconductor device structure, enabling the device to self-test its own inter-die connections. This self-service capability eliminates the need for external, time-consuming inspection equipment and processes, allowing immediate defect detection during or after bonding.
2Measurement precision
If physical cross-sectioning is used to verify inter-die connections, then measurement precision is improved, but loss of time increases and device complexity increases
Solution Approach 1:
The patent replaces destructive physical cross-sectioning with non-destructive electrical measurement. The test diode circuits provide electrical access to inter-die connections, allowing verification through electrical characteristics without physical sectioning, thereby eliminating time loss and preserving device integrity.
Solution Approach 2:
The test diode circuits create an electrical replica or model of the inter-die connection path. By measuring the electrical characteristics of these test circuits, the patent obtains information about the actual inter-die connections without physically accessing or sectioning them, providing a virtual copy for verification.
3Device complexity
If build in self-test (BIST) is used, then device complexity is reduced, but loss of time increases due to delayed data availability
Solution Approach 1:
The test diode circuits are prepared and integrated during the manufacturing process, before the actual bonding occurs. This preliminary preparation allows the test structure to be ready for immediate use, enabling real-time or near-real-time defect detection and feedback without requiring post-packaging socketing or additional processing steps.
Solution Approach 2:
The patent implements a feedback mechanism where test measurements of the diode circuits provide immediate information about inter-die connection quality. This feedback loop allows real-time process monitoring and adjustment, eliminating the delayed feedback inherent in traditional BIST methods that require post-packaging testing.
4Measurement precision
If manual X-Ray of joints is used, then measurement precision is improved, but productivity decreases due to hours per unit
Solution Approach 1:
The patent replaces slow manual X-Ray inspection with rapid electrical measurement of test diode circuits. This substitution reduces inspection time from hours per unit to moments per unit, dramatically increasing productivity while maintaining defect detection capability through electrical characteristic analysis.
Solution Approach 2:
The patent changes the measurement parameter from physical imaging (X-ray) to electrical measurement (diode circuit characteristics). This parameter change enables much faster measurement speeds suitable for high-volume manufacturing, as electrical measurements can be performed rapidly without the mechanical constraints of X-ray imaging systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables real-time monitoring and adjustment of the bonding process, reducing the occurrence of defects and significantly shortening the time to detect issues, thereby improving production efficiency and reducing delays in product release.
Implementation Method 1
an electrical connection structure electrically conductively coupling the first contact and the second contact with each other via at least one non-releasable interconnection of the non-releasable interconnections
Data Source
AI summary
A semiconductor stack, including a carrier and a semiconductor device arranged above the carrier; non-releasable interconnections electrically and mechanically connecting the semiconductor device and the carrier; a first contact on at least one of the carrier or the semiconductor device: a second contact on at least one of the carrier or the semiconductor device; an electrical connection structure electrically conductively coupling the first contact and the second contact with each other via at least one non-releasable interconnection of the non-releasable interconnections; and wherein the electrical connection structure comprises a plurality of test diode circuits integrated in at least one of the carrier and the semiconductor device, wherein each of the test diode circuits comprises one or more diodes.