Test Handler Pusher Temperature Control via Localized Airflow
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Solution Overview
Problem
The increasing demand for testing multiple semiconductor elements simultaneously poses challenges in maintaining uniform temperature control, as temperature differences between stacked chips and varying test temperatures complicate performance inspections, especially in harsh environments.
Innovation Solution
A test handler and semiconductor element test device featuring a pusher system with a porous match plate and airflow management, including a heater and variable flow tunnel, to control temperature by transferring heat and airflow effectively across the test tray and pushers, reducing temperature differences within and between semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor elements are tested simultaneously to increase productivity, then testing efficiency is improved, but temperature uniformity deteriorates due to position-dependent temperature variations
Solution Approach 1:
The patent implements independent temperature control for different regions of the test tray by providing separate heaters (first heater for central region, second heater for outer region) and independent airflow control (first airflow path for central pusher, second airflow path for outer pusher). This allows each pusher to maintain its own target temperature independently, ensuring temperature uniformity across multiple semiconductor elements tested simultaneously while maintaining high productivity.
2Adaptability or versatility
If stacked chips are used to increase functionality, then electronic component capabilities are improved, but temperature difference between upper and lower chips increases making performance inspection difficult
Solution Approach 1:
The patent applies local quality by providing independent temperature control for each pusher position. The central pusher and outer pusher each have dedicated heaters and airflow paths, allowing the system to independently adjust temperatures at different vertical positions and locations. This enables uniform temperature distribution across stacked chips despite their different positions, maintaining functionality while eliminating temperature differences that would affect performance inspection.
3Measurement precision
If test temperature is increased to improve testing accuracy, then measurement precision is improved, but temperature variation across different positions increases
Solution Approach 1:
The patent implements parameter changes by independently controlling temperature parameters for different regions. The control unit can set different target temperatures for the first heater and second heater, and adjust airflow parameters separately for central and outer pushers. This allows the system to maintain high test temperatures for accuracy while compensating for position-dependent temperature variations through localized parameter adjustment, thereby reducing overall temperature variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature control, reducing temperature variations within and between semiconductor elements, thereby improving the efficiency and accuracy of performance inspections across a range of temperatures.
Implementation Method 1
the pusher end configured to come into contact with the DUT to transfer heat, and the pusher body configured to conduct heat to the pusher end
Implementation Method 2
the airflow input port configured to provide an airflow to the plurality of holes such that the airflow passes through the plurality of holes and through a separated space between the test tray and the pusher body
Implementation Method 3
a heater on an upper surface of the porous match plate, the heater configured to control a temperature of the pusher
Data Source
AI summary
A test handler includes a pusher which includes a pusher end which comes into contact with a DUT (Device Under Test) to transfer heat, and a pusher body which conducts heat to the pusher end, the pusher end separating a test tray for fixing the DUT and the pusher body from each other; a porous match plate including a pusher arrangement region in which the pusher body is placed, and a plurality of holes placed adjacent to the pusher arrangement region; a heater placed on an upper surface of the porous match plate to control temperature of the pusher; and an airflow input port placed on the heater to provide the airflow to the plurality of holes, in which the airflow passes through the plurality of holes and passes through a separated space between the test tray and the pusher body.