Test Head Push-Off Tabs for Adhesion-Free IC Release
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Solution Overview
Problem
Existing thermal testing equipment often damages integrated circuit (IC) packages due to adhesion between the test head and the IC device, limiting the variety of ICs that can be tested and requiring costly rework for different designs.
Innovation Solution
The implementation of push off tabs that create a reactionary force against adhesive forces, allowing efficient disengagement of the IC from the test head without manual intervention, and can be easily replaced for different IC types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal testing is performed using a test head that contacts the IC device, then thermal management evaluation is achieved, but adhesion between the test head and IC device causes damage to the IC package
Solution Approach 1:
A release film is introduced as an intermediary layer between the test head and the IC device. This release film prevents direct adhesion between the test head and IC device while still allowing thermal testing to occur, thereby eliminating damage to the IC package during testing operations
Solution Approach 2:
The release film is designed as a disposable component that is consumed during the testing process. By using a low-cost, single-use release film, the system prevents expensive IC device damage from adhesion, making the overall process more reliable and cost-effective
2Manufacturing precision
If the test head is designed for specific IC types, then testing precision is improved, but adaptability to different IC designs decreases
Solution Approach 1:
The release film is designed with universal applicability to work with multiple IC device types and test head configurations. This allows a single release film design to serve multiple testing scenarios, maintaining testing precision across different IC designs without requiring specialized tooling for each IC type
3Measurement precision
If manual intervention is required to separate the IC device from the test head, then testing accuracy is maintained, but productivity decreases
Solution Approach 1:
The release film enables self-service separation of the IC device from the test head. As the release film is consumed or degraded during testing, it automatically facilitates device release without requiring manual intervention, thereby maintaining testing accuracy while significantly improving productivity and testing throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The push off tabs effectively prevent IC damage during thermal testing, enhance testing efficiency, and reduce the need for manual intervention, while being adaptable to various IC designs.
Implementation Method 1
adhesion between the test head and the IC device
Data Source
Figure 1A~1C
Figure 1D~1E
Figure 2A~2D
AI summary
Methods and apparatus to disengage a test head from an integrated circuit (IC) device are disclosed. An example apparatus comprises a test head to thermally interface with an IC device, a mounting piece to be coupled to the test head, and a push off tab to be mounted to the mounting piece, the push off tab including an arm to extend underneath the test head, the arm to contact the IC device before the test head is to contact the IC device.