Test Head Vacuum Connection for Direct Wafer Docking
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Solution Overview
Problem
Traditional probing machines require a pogo tower for signal transmission, leading to longer signal paths, interference, and signal attenuation, and lack a method to switch to direct docking mode.
Innovation Solution
A test head connection method where the load board is placed on the probing machine, and the test head uses a vacuum function to securely attach to the load board, allowing direct docking and reducing signal transmission path length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pogo tower is used for signal transmission, then the connection between load board and wafer is established, but the signal transmission path becomes longer and signal attenuation increases
Solution Approach 1:
The patent removes the pogo tower from the signal transmission path and implements direct docking between the load board and wafer. The load board is repositioned to directly contact the wafer surface, eliminating the intermediate pogo tower connection and thereby shortening the signal transmission path while maintaining reliable electrical connection.
Solution Approach 2:
The patent introduces a new intermediary structure (the repositioned load board with direct contact mechanism) that enables shorter signal transmission. By changing the intermediary from a pogo tower to a direct load board-wafer interface, the signal path is shortened while connection reliability is maintained through precise positioning and contact mechanisms.
2Stability of the object's composition
If the load board is locked to the test head, then the mechanical connection is stable, but the load board cannot be positioned close enough to the wafer for direct docking
Solution Approach 1:
The patent transforms the static, fixed positioning of the load board on the test head into a dynamic, adjustable positioning system. The load board is made movable relative to the test head through a positioning mechanism that allows it to be precisely adjusted to the optimal distance for direct wafer contact, enabling both stability and proximity.
Solution Approach 2:
The patent separates the load board from the test head structure, allowing independent positioning and adjustment. By making the load board a separable, independently positionable component rather than a fixed part of the test head, the system achieves both mechanical stability through secure mounting and close proximity to the wafer through adjustable positioning.
3Length of moving object
If the test head is moved closer to the probing machine, then direct docking becomes possible, but the mechanical fixing method becomes more complex
Solution Approach 1:
The patent designs a universal fixing mechanism that serves multiple functions: it secures the test head to the probing machine, enables precise positioning for direct docking, and maintains mechanical stability during operation. This multi-functional fixture reduces overall system complexity by combining what would otherwise require separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method stabilizes the connection between the test head and the probing machine, reduces signal interference and attenuation, and enables direct docking, improving the efficiency of wafer testing.
Implementation Method 1
the load board can be sucked tightly by the vacuum function of the test head to increase the stability between the test head and the probing machine
Data Source
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AI summary
Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.