Test Interconnect Conductive Planes for DUT Power Integrity

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Solution Overview

Problem

Existing test systems for packaged integrated circuits lack accurate detection of voltage near the device under test, leading to power integrity issues that cause current and heat-related damage.

Innovation Solution

Incorporating a circuit board with conductive planes on the DUT side of the test interconnect assembly, providing additional conductive paths for supply voltage and ground connections, and using Kelvin probes for precise voltage measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If voltage is measured from the load board side of the socket using spring probes, then the measurement can be performed with existing equipment, but the measurement accuracy is reduced due to parasitic losses and bandwidth limitations

Engineering Contradiction:

Improvevoltage measurement accuracyVSAvoidmeasurement system complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces an intermediary circuit board with conductive planes positioned between the load board and the device under test. This circuit board provides dedicated voltage sensing points close to the DUT, acting as a mediator that enables accurate voltage measurement without requiring direct access to the DUT internal nodes. The intermediary structure includes sense traces and reference planes that minimize measurement errors while maintaining system modularity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If existing test sockets are used without additional conductive paths, then the device complexity is minimized, but power integrity deteriorates due to current fluctuations and voltage drops

Engineering Contradiction:

Improvepower integrityVSAvoidtest socket structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent adds another dimensional layer to the test socket structure by introducing a circuit board with multiple conductive planes. This additional dimension provides multiple parallel conductive paths for power and signal transmission, increasing current carrying capacity and reducing impedance. The multi-layer construction includes power planes, ground planes, and signal traces that work together to improve power integrity without significantly increasing overall device complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The test socket is segmented into functional modules: the load board interface, the intermediary circuit board with conductive planes, and the DUT interface. This segmentation allows each module to be optimized independently - the circuit board can be designed with specific trace geometries and plane configurations to address power integrity issues, while the overall system maintains modularity and ease of assembly.

Inventive Principle:

Principle #1Segmentation

3Reliability

If spring probes are used for voltage measurement, then the ease of operation is improved, but the reliability decreases due to contact instability and heat generation

Engineering Contradiction:

Improvecontact stabilityVSAvoidprobe connection ease

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent merges the voltage measurement function with the power delivery function by integrating sense traces directly into the circuit board structure. Instead of using separate spring probes for measurement, the design combines power traces and sense traces on the same circuit board, providing both power delivery and voltage sensing through integrated conductive paths. This merging eliminates the need for separate probe connections, improving both reliability and ease of operation.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances power integrity by reducing current fluctuations and heat damage, enabling accurate voltage measurement and improving reliability during testing.

Implementation Method 1

The circuit board includes one or more conductive planes that provide a conductive path for a supply voltage for a device under test (DUT)

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a housing structure that houses at least a portion of one or more compressible probes

Methodology Applied

Scientific EffectElastic compression: Elasticity

Data Source

PatentUS20260016501A1Test interconnect with conductive planes and components for power integrity and thermal management

Publication Date: 2026.01.15 ESSAI INC

AI summary

Test interconnect systems and methods are described. In one example, a test interconnect includes a housing structure that houses at least a portion of one or more compressible probes. The test interconnect also includes a plate that retains the one or more compressible probes relative to a load board, and a circuit board with one or more conductive planes that provide a conductive path for a supply voltage for a device under test. The circuit board is positioned on a side of the housing structure relative to a device under test that is opposite the load board side.