Semiconductor Test Module Temperature Controller Segmentation
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Solution Overview
Problem
The increasing capacity of semiconductor devices has led to longer testing times, and existing test handlers face challenges in maintaining consistent temperatures, resulting in reduced reliability due to temperature differences in connection lines and connectors during high and low-temperature testing.
Innovation Solution
A test module and handler system that includes a base board with separate temperature controllers to maintain connection lines and docking connectors at different temperatures, ensuring semiconductor devices are tested at consistent high or low temperatures, independent of room temperature conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the test apparatus is maintained at room temperature while testing semiconductor chips at high or low temperatures, then the test apparatus can operate stably, but temperature differences occur in the semiconductor chips due to connection lines or connectors, reducing test reliability
Solution Approach 1:
The base board is divided into multiple temperature control zones with separate temperature controllers. Each connection line or group of connection lines has its own temperature controller, allowing independent temperature management for each segment. This segmentation enables different parts of the connection infrastructure to be maintained at different temperatures, preventing temperature differences in the semiconductor chips while allowing the test apparatus to operate at room temperature.
Solution Approach 2:
Different regions of the base board are provided with different temperature characteristics through localized temperature control. Each temperature controller maintains its associated connection lines at a specific temperature appropriate for the testing conditions, creating local thermal environments that match the requirements of the semiconductor devices being tested, thereby ensuring temperature uniformity across all chips.
2Reliability
If separate temperature controllers are provided for each connection line or group of connection lines, then temperature differences in semiconductor chips are eliminated, but the device complexity increases
Solution Approach 1:
Each temperature controller is designed as a multi-functional module that can serve multiple connection lines or groups of connection lines simultaneously. The temperature controllers are configured to manage thermal conditions for various components within the base board, reducing the total number of separate temperature control devices needed while still providing individualized temperature management for each connection pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of semiconductor device testing by maintaining uniform temperatures across the device under test, reducing temperature-related noise and improving the efficiency of the testing process.
Implementation Method 1
A first temperature controller maintains the connection lines at a first temperature
Implementation Method 2
A first temperature controller maintains the connection lines at a first temperature
Implementation Method 3
A second temperature controller maintains the docking connector at a second temperature different from the first temperature
Implementation Method 4
A second temperature controller maintains the docking connector at a second temperature different from the first temperature
Data Source
AI summary
A test module, is provided including a tester that electrically tests a semiconductor device. A device under test (DUT) board is connected to the tester and the semiconductor device. A base board is disposed between the DUT board and the tester. The base board includes a lower plate, a plurality of connection lines that penetrate the lower plate, an upper plate disposed on the lower plate, and a first temperature controller disposed in the base board. The first temperature controller maintains the connection lines at a first temperature. A docking connector is disposed on the first temperature controller. The docking connector connects the connection lines to the DUT board. A second temperature controller is disposed between the first temperature controller and the upper plate. The second temperature controller maintains the docking connector at a second temperature different from the first temperature.