Test Pattern for Printing Displacement Measurement
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Solution Overview
Problem
Existing test patterns for printing are inadequate in measuring impact displacement caused by factors beyond positional misalignment, limiting their effectiveness in correcting printing errors.
Innovation Solution
A test pattern configuration that allows measurement of at least three types of impact displacement using multiple nozzle columns and print chips, enabling displacement measurement through single or dual main scans, and utilizing crossmarks and ruled lines to detect positional differences across the print medium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing test patterns are used for printing calibration, then printing accuracy can be maintained for basic misalignment, but measurement of impact displacement caused by factors beyond positional misalignment is inadequate
Solution Approach 1:
The test pattern is divided into multiple separate test pattern groups, each designed to measure specific types of impact displacement (head displacement, chip displacement, column displacement). This segmentation allows comprehensive measurement of six types of displacement while maintaining clear functional separation for accurate detection of each displacement type.
Solution Approach 2:
The test pattern system is designed to universally measure all six types of impact displacement (three directions × two passes) through a unified framework. Multiple nozzle columns and print chips work together in a single test pattern configuration to enable comprehensive measurement of head displacement, chip displacement, and column displacement in both main scanning directions.
2Measurement precision
If multiple nozzle columns and print chips are used to measure all six types of displacement, then measurement comprehensiveness is improved, but test pattern creation time and medium area requirements increase
Solution Approach 1:
Multiple test pattern groups that would traditionally require separate printing operations are merged into a single integrated test pattern. The first and second nozzle columns from different print chips are combined in one test pattern configuration, allowing measurement of all six displacement types to be completed in a single printing operation rather than multiple sequential operations.
Solution Approach 2:
The test pattern structure is designed to perform multiple measurement functions simultaneously. A single test pattern configuration enables measurement of head displacement, chip displacement, and column displacement in both forward and reverse passes, eliminating the need for separate test patterns for each displacement type and significantly reducing creation time.
3Measurement precision
If a comprehensive test pattern measuring all six displacement types is created, then measurement capability is improved, but the area of print medium required increases
Solution Approach 1:
The test pattern utilizes the intersecting direction (sub-scanning direction) as an additional dimension to compact the measurement structure. By arranging test pattern groups at different positions in the intersecting direction and using multiple nozzle columns that print in overlapping ranges, the pattern fits within a smaller area while still enabling comprehensive measurement of all six displacement types.
Solution Approach 2:
The overlapping print ranges of different nozzle columns are merged to create a compact test pattern structure. The first nozzle column and third nozzle column print in ranges that partially overlap in the intersecting direction, allowing multiple measurement functions to be packed into a smaller medium area without compromising measurement capability.
Data Source
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AI summary
A test pattern is formed by selecting at least three parts from among parts for measuring an impact displacement due to print head displacement between first and second print heads, an impact displacement due to chip displacement between first and second chips, an impact displacement due to round-trip displacement between a forward pass and a reverse pass of main scanning, an impact displacement due to column displacement between first and second nozzle columns, an impact displacement due to position displacement of the first print head around a main scanning direction, and position displacement of the first print head, and an impact displacement due to position displacement of the first print head around a direction orthogonal to the main scanning direction and a direction intersecting with the main scanning direction. The test pattern has a length in a sub scanning direction less than that of the head. The at least three parts are arranged in the sub scanning direction.