Test Probe Aligner Backer Plate Auto-Alignment
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Solution Overview
Problem
Current test probe alignment methods require manual, time-consuming, and error-prone processes to achieve precise alignment of thousands of pins with semiconductor devices, often resulting in misalignment and the need for additional mechanical steps, which can lead to incomplete contact and heat dissipation issues.
Innovation Solution
A test probe aligner system comprising a backer plate, stiffener, and bridge beam with actuators and force measurement sensors that automatically adjusts the test probe card to achieve precise alignment and apply necessary forces for contact, allowing for self-correction and flexible alignment in the z-direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual alignment steps are used to align test probe card with devices under test, then alignment precision can be achieved, but the process becomes time-consuming and requires special expertise
Solution Approach 1:
The backer plate is pre-positioned on the test probe card before the alignment process begins. This preliminary positioning establishes a reference structure that guides subsequent automated alignment operations, eliminating the need for time-consuming manual setup while maintaining precision requirements
Solution Approach 2:
The backer plate acts as an intermediary element between the test probe card and the alignment system. It provides a stable mounting surface and structural reference that facilitates automated alignment without requiring direct manual manipulation of the probe cards themselves
2Reliability
If manual alignment steps are used to establish electrical contacts, then contact reliability can be ensured, but the process requires special expertise and is time-consuming
Solution Approach 1:
The test probe card with mounted backer plate is designed to self-align with the devices under test through the structural support and positioning features provided by the backer plate. This self-aligning mechanism ensures reliable electrical contacts without requiring operators to perform complex manual adjustment procedures
Solution Approach 2:
The backer plate is pre-mounted on the test probe card with precise positioning features that establish correct alignment before testing begins. This preliminary preparation ensures that electrical contacts are reliably established automatically, eliminating the need for complex manual intervention during operation
3Manufacturing precision
If tight tolerances are applied for alignment, then contact quality improves, but manufacturing complexity increases
Solution Approach 1:
The backer plate serves as an intermediary structure that absorbs and compensates for manufacturing tolerances. It provides a stable reference framework that maintains tight alignment tolerances between the test probe card and devices under test without requiring the entire alignment system to be manufactured with equally tight tolerances
Solution Approach 2:
The backer plate structure enables adjustment of alignment parameters such as position and orientation. This adjustability allows the system to achieve tight effective tolerances through mechanical compensation rather than requiring ultra-precise manufacturing of all components
Data Source
AI summary
A test probe aligner for aligning a test probe card with devices under test of a wafer is provided. The test probe aligner includes a backer plate arranged with its bottom side to the test probe card, and a stiffener mounted to the test probe card outside a horizontal dimension of the backer plate. The stiffener and a top side of the backer plate end in a same plane above the test probe card. The alignment further includes a bridge beam locked to a top side of the stiffener. Furthermore, the test probe aligner also includes at least two actuators and at least two corresponding force measurement sensors below a top surface of the bridge beam, arranged such that forces are applicable to the test probe card.