Test Probe Substrate Lateral Extensions for Alignment

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Solution Overview

Problem

Integrated circuit test probes face challenges due to substrate distortion and misalignment of electrical contacts, leading to non-planarity and positional inaccuracies, which affect compatibility with test hardware and performance across temperature ranges.

Innovation Solution

A method involving the formation of a test probe substrate with a dielectric layer and conductive material deposition, including lateral extensions to correct misalignment and non-planarity, using materials like LTCC substrates with a coefficient of thermal expansion matched to silicon, and planarization techniques to ensure accurate and uniform contact regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional test probe substrates are used, then manufacturing is simpler, but substrate distortion and misalignment occur leading to poor contact location accuracy

Engineering Contradiction:

Improvecontact location alignmentVSAvoidsubstrate structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces a lateral extension dimension to the contact openings, transforming them from simple vertical holes into three-dimensional structures with horizontal components. This dimensional change allows the openings to reach misaligned contact locations while maintaining a planar top surface, thereby improving alignment accuracy without fundamentally redesigning the substrate architecture.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent performs preliminary alignment correction by forming lateral extensions in the dielectric layer before final contact formation. This preliminary action compensates for anticipated misalignment issues, allowing subsequent processing steps to proceed with accurate contact location positioning despite substrate distortion.

Inventive Principle:

Principle #10Preliminary action

2Stability of the object's composition

If substrate materials with mismatched thermal expansion coefficients are used, then manufacturing is easier, but non-planarity develops across temperature ranges

Engineering Contradiction:

Improveplanarity across temperature rangesVSAvoidsubstrate material selection

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent changes the physical parameters of the contact openings by adding lateral extensions that can compensate for thermal distortion. The extensions are designed to accommodate expansion and contraction movements, maintaining contact integrity across temperature ranges without requiring specialized low-expansion substrate materials.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If misaligned contact locations are not corrected, then fabrication is faster, but compatibility with test hardware is poor

Engineering Contradiction:

Improvecompatibility with test hardwareVSAvoidcontact opening structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by providing lateral extensions only at specific contact openings where misalignment occurs, rather than uniformly modifying all openings. This localized approach maintains compatibility with test hardware at affected locations while minimizing overall structural complexity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables effective alignment and planarity correction, supporting high power delivery, frequency testing, and flexibility across temperature ranges, with improved throughput and compatibility for both single die and wafer-level testing.

Implementation Method 1

using materials like LTCC substrates with a coefficient of thermal expansion matched to silicon

Methodology Applied

Scientific EffectThermal expansion matching: Thermal Expansion

Implementation Method 2

planarization techniques to ensure accurate and uniform contact regions

Methodology Applied

Scientific EffectPlanarization:

Implementation Method 3

An electrically conductive material is deposited within the second openings to form an array of electrical contact regions

Methodology Applied

Scientific EffectConductive material deposition: Deposition (physical)

Data Source

PatentUS9897627B2Test probe substrate

Publication Date: 2018.02.20 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.