Test Socket Antenna Integration for Wireless RF Testing
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Solution Overview
Problem
Existing test contactor technologies cannot communicate wirelessly with semiconductor devices that incorporate antennas in package, particularly those operating at high frequencies such as 76-81 GHz, due to the complex and crowded nature of modern printed circuit boards.
Innovation Solution
A test socket assembly with a contactor body and lead frame assembly that includes one or more antennas, configured to directly and wirelessly communicate with the device under test, using compliant interconnects for low-speed signals and wave guides for high-speed signals, allowing for hybrid communication methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing test contactor technology is used, then the testing system maintains simplicity, but it cannot communicate wirelessly with antenna in package devices
Solution Approach 1:
The patent combines traditional compliant interconnects for electrical contact with integrated antennas for wireless communication into a single test contactor assembly. This merging allows the test system to simultaneously maintain physical contact for low-speed signals while enabling wireless communication for high-speed RF signals, thus achieving adaptability to test antenna in package devices without excessive complexity increase
Solution Approach 2:
The test contactor is designed with multi-functionality by incorporating both compliant interconnects for traditional electrical testing and antennas for wireless RF communication. This universal design enables the same test contactor to handle both low-speed contacted signals and high-speed wireless signals, making the testing system versatile for various device types including antenna in package devices
2Adaptability or versatility
If wireless communication is added to test contactor, then communication capability with antenna in package devices is enabled, but device complexity increases
Solution Approach 1:
The antenna structures are nested within the contactor body, with radiation openings positioned to allow wireless signal transmission while maintaining the compact form factor. The compliant interconnects and antennas are integrated in a nested arrangement where the antennas are disposed within the contactor body structure, enabling wireless communication capability without significantly increasing external dimensions or overall complexity
3Ease of operation
If compliant interconnects are used for low-speed signals, then standard interfaces are maintained, but high-speed wireless signal transmission requires additional components
Solution Approach 1:
The signal transmission system is segmented into two distinct pathways: compliant interconnects for low-speed electrical signals and antennas for high-speed wireless signals. This segmentation allows each component to be optimized for its specific function while maintaining interface compatibility through the compliant interconnects, without requiring the entire system to be redesigned for high-speed operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and efficient testing of semiconductor devices with integrated antennas by allowing direct wireless communication, maintaining standard input and output interfaces, and supporting high-speed signal transmission.
Implementation Method 1
one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test
Implementation Method 2
a wave guide disposed between the printed circuit board and the lead frame assembly, where the wave guide communicates high speed signals to the one or more antennas
Data Source
AI summary
A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.