Test Socket Conductive Coating for Signal Integrity
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Solution Overview
Problem
Existing test devices for high-frequency or high-speed semiconductors have complex structures that increase fabrication costs and can lead to errors in alignment and machining, resulting in poor performance in insertion loss, return loss, crosstalk, isolation, Z-impedance, and inductance characteristics.
Innovation Solution
A test socket with a simple structure is developed, featuring a socket block made of insulating material with a probe hole and a conductive coating on both the outer surface and the inner surface of the probe hole, with portions of the internal film electrically isolated from the external film to support the probes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal probes are mounted to a conductive block without contact using insulating plates, then interference between adjacent signal probes is prevented, but the structure becomes complex and fabrication costs increase
Solution Approach 1:
The patent merges the insulating plate and conductive block into a single integrated insulating substrate structure. The signal probes are mounted directly to the insulating substrate without requiring separate insulating plates, thereby simplifying the structure while maintaining interference prevention between adjacent probes.
2Ease of operation
If insulating plates are added to support signal probes, then probe support is achieved, but alignment errors between probe holes and supporting holes worsen electrical characteristics
Solution Approach 1:
The patent combines the probe support function directly into the insulating substrate structure. The signal probes are supported by the insulating substrate itself through integrated support structures, eliminating the need for separate insulating plates and their associated alignment holes, thereby improving manufacturing precision.
3Stability of the object's composition
If a complex multi-component structure is used for probe support, then probe stability is improved, but fabrication costs increase
Solution Approach 1:
The patent integrates multiple functions (insulation, probe mounting, probe support, and electrical isolation) into a single insulating substrate structure. This consolidation reduces the number of components and assembly steps, thereby lowering fabrication costs while maintaining probe stability through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The test socket achieves improved insertion loss, return loss, crosstalk, isolation, Z-impedance, and inductance characteristics while maintaining a simple structure that reduces fabrication costs and minimizes alignment and machining errors.
Implementation Method 1
a coating portion comprising an external film of a conductive material coated on an outer surface of the socket block, and an internal film of a conductive material coated on an inner surface of the probe hole
Data Source
AI summary
A test socket includes a socket block of an insulating material, provided with a probe hole to accommodate the probe, and a coating portion comprising an external film of a conductive material coated on an outer surface of the socket block, and an internal film of a conductive material coated on an inner surface of the probe hole, at least a portion of the internal film being electrically isolated from the external film.