Test Socket Conductive Column Fixation via Grooves and Brackets

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Solution Overview

Problem

Current test socket designs for integrated circuit (IC) testing face challenges in securing conductive columns to the insulating support, leading to insufficient fixation strength, potential short circuits, and reduced durability due to material differences and residual mold particles, which affect the stability and longevity of electrical connections.

Innovation Solution

The test socket features an insulating support structure with through-holes and grooves for enhanced fixation of conductive columns, a composite hard and soft support structure, and anti-short-circuit brackets made of insulating material to prevent short circuits, along with a manufacturing method involving sacrificial layers and conductive gel formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the conductive columns are made softer to accommodate IC variations, then the flexibility and adaptability improve, but the fixation strength to the insulating support deteriorates

Engineering Contradiction:

ImproveflexibilityVSAvoidfixation strength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The test socket employs a composite structure where a harder insulating support material (e.g., polyimide, PCB, or ceramic) provides strong mechanical fixation for the conductive columns, while a softer support material (e.g., silicone) layered on top provides flexibility and adaptability. This composite approach allows the conductive columns to be securely held while still accommodating IC variations through the compliant soft support layer.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If the conductive columns are made taller to increase flexibility, then the adaptability improves, but the risk of short circuits increases

Engineering Contradiction:

ImproveflexibilityVSAvoidshort circuit risk

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

Anti-short-circuit brackets are introduced as intermediary insulating structures positioned between adjacent conductive columns. These brackets prevent direct contact between conductive columns while allowing the columns to maintain their increased height for flexibility. The brackets act as mediators that enable the beneficial effect of taller columns without the harmful consequence of short circuits.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If the stamper method is used to mold conductive columns, then the manufacturing ease improves, but the ability to increase column height and remove residual particles deteriorates

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidresidual particle removal

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent extracts and removes the harmful residual mold metal particles from the conductive column surface through a cleaning step in the manufacturing process. This extraction of contaminants allows the use of alternative molding methods that can produce taller columns with better surface quality, overcoming the limitations of the traditional stamper method.

Inventive Principle:

Principle #2Taking out (Extraction)

4Duration of action of stationary object

If a harder support material is used to increase fixation strength, then the durability improves, but the flexibility and adaptability deteriorate

Engineering Contradiction:

ImprovelifetimeVSAvoidflexibility

Core Design Contradiction:

Duration of action of stationary objectVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly increases the fixation strength and durability of conductive columns, reduces the risk of short circuits, and ensures stable electrical connections during IC testing, enhancing the overall reliability and longevity of the test socket.

Implementation Method 1

Filling the through-holes with a conductive gel to form multiple conductive columns

Methodology Applied

Scientific EffectConductive gel formation: Gel

Data Source

PatentUS20250102538A1Test socket for IC testing and manufacturing method thereof

Publication Date: 2025.03.27 HE CHOU TECH INC

AI summary

A test socket for integrated circuit (IC) testing is provided and comprises an insulating support structure and multiple conductive columns. The insulating support structure features multiple through-holes designed to accommodate the conductive columns. Parts of the conductive columns are embedded within the insulating support structure and extend through these through-holes to establish electrical connections for IC testing. The conductive columns are elastic, allowing them to accommodate variations caused by warpage of the IC packaging and the tolerances in BGA solder ball sizes. Additionally, the insulating support structure incorporates multiple grooves located next to the through-holes, where parts of the conductive columns are embedded, enhancing the fixation strength of the conductive columns to the insulating support structure. Furthermore, the test socket includes anti-short-circuit brackets positioned beside the conductive columns to prevent them from contacting each other and causing short circuits. The invention also provides a method for manufacturing this test socket.