Test Socket Conductive Ink Repair for Fine-Pitch Semiconductor Packages
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Solution Overview
Problem
The increasing fineness of semiconductor packages leads to higher manufacturing costs and shorter lifetimes of test sockets, as the conductive particles on the test sockets degrade, causing contact issues and reduced conductivity.
Innovation Solution
A method of manufacturing test sockets that includes forming a second conductive portion using conductive ink on a first conductive portion, with the second conductive portion being elevated relative to the base material and having a concave or uneven surface, formed using a 3D printer, to improve contact and reduce wear, thereby extending the lifespan of the test sockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the fineness of semiconductor packages is increased, then the testing precision is improved, but the manufacturing cost of test sockets increases and their lifetime decreases
Solution Approach 1:
The patent applies parameter changes by modifying the surface morphology of conductive portions through 3D printing, creating concave and convex structures that change the physical parameters of the contact surface. This increases the contact area and distributes wear across multiple points, thereby extending test socket lifetime while maintaining testing precision for fine-pitch semiconductor packages
2Measurement precision
If the fineness of semiconductor packages is increased, then the testing precision is improved, but the manufacturing cost of test sockets increases
Solution Approach 1:
The patent uses 3D printing technology to change the manufacturing approach, creating complex concave-convex surface structures that would be difficult and expensive to manufacture using traditional methods. This additive manufacturing approach reduces costs while achieving the required precision for fine-pitch testing
Solution Approach 2:
The patent transitions from traditional planar conductive surfaces to three-dimensional concave-convex structures, utilizing the vertical dimension to create multiple contact levels. This dimensional change increases contact area and improves electrical connectivity without requiring proportionally higher manufacturing costs
3Ease of manufacture
If conventional conductive structures are used, then the manufacturing process is simple, but contact resistance increases and conductivity decreases
Solution Approach 1:
The patent transforms conventional flat conductive surfaces into multi-level concave-convex structures, utilizing the third dimension to create overlapping contact zones. This dimensional enhancement increases the effective contact area and provides multiple parallel conduction paths, thereby reducing contact resistance and improving electrical reliability while maintaining manufacturing feasibility through 3D printing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the lifespan and reduces the manufacturing costs of test sockets by maintaining contact and conductivity through the use of a second conductive portion that refills and reinforces the first conductive portion, allowing for repeated use and reduced wear.
Implementation Method 1
The conductive material may establish an electrical connection between the semiconductor package and a test device
Data Source
AI summary
Configuring a test socket to electrically couple a semiconductor package to a test device includes preparing a test socket including a base material and a first conductive portion included in the base material. The first conductive portion may extend in a thickness direction of the base material. Configuring the test socket may include forming a second conductive portion including conductive ink on the first conductive pattern. The second conductive portion may be formed based on printing conductive ink on the first conductive portion. The configuring may include forming the second conductive portion to repair the test socket. The first conductive portion may be degraded such that a top surface of the first conductive portion includes a surface depression. The second conductive portion may fill the surface depression. The first and second conductive portions may be integral with each other.