Test Socket Impedance Matching via Conductive Resin Substrates
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Solution Overview
Problem
Existing test sockets fail to achieve accurate impedance matching for high-frequency signals above 10 GHz due to the insulating substrate not acting as an outer conductor, leading to performance deterioration from reflection and crosstalk.
Innovation Solution
A test socket design featuring a positioning resin substrate with conductive portions forming a conductive path, allowing contact terminals to be positioned orthogonally and ensuring electrical conductivity between central and end-side housings, along with guiding resin substrates to facilitate accurate plunger motion and prevent malfunctions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an insulating substrate is used to support the contact terminal, then positioning of the contact terminal is achieved, but impedance matching cannot be performed and high frequency signal characteristics deteriorate
Solution Approach 1:
The patent uses a composite structure combining insulating resin substrate with conductive elements (conductive adhesive, conductive holes, conductive patterns) to achieve both positioning function and electrical conductivity. This allows the substrate to simultaneously provide mechanical support/positioning and serve as an outer conductor for impedance matching, resolving the contradiction between positioning precision and impedance matching capability.
2Reliability
If a coaxial probe is constructed using air space between contact terminal and insertion hole, then impedance matching is improved, but the structure becomes complex and manufacturing difficult
Solution Approach 1:
The patent changes the material parameter of the substrate from purely insulating to conductive by incorporating conductive adhesive, conductive holes, or conductive patterns. This allows the substrate itself to serve as the outer conductor, eliminating the need for complex air-space coaxial probe structures while maintaining impedance matching performance.
3Measurement precision
If the positioning resin substrate is made insulating, then positioning accuracy is achieved, but electrical conductivity between housings is lost
Solution Approach 1:
The patent creates a composite material system where the resin substrate provides positioning accuracy while conductive elements (conductive adhesive layers, conductive holes filled with conductive material, or conductive patterns) provide electrical conductivity. This composite approach allows the substrate to simultaneously fulfill both positioning and conduction functions without compromising either property.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate impedance matching and reliable inspection of high-frequency signals beyond 10 GHz by maintaining conductivity through the resin substrates, reducing crosstalk, and preventing malfunctions due to precise plunger guidance.
Implementation Method 1
the positioning resin substrate includes a conductive portion configured to form a conductive path in the axial direction
Implementation Method 2
by forming an air space between an outer periphery of a contact terminal and an insertion hole of a metal block into which the contact terminal is inserted, a coaxial probe is constructed using a signal contact terminal as a central conductor, and an inner wall of the insertion hole as an outer conductor
Data Source
AI summary
The test socket includes a fifth housing 15 located in a central part of contact terminals 21 in an axial direction and having electrical conductivity, plural through-holes 15c being formed in the fifth housing 15 to pass the respective contact terminals 21 therethrough; a sixth housing 16 stacked in the axial direction on the fifth housing 15, passage holes being formed in the sixth housing 16, the passage holes being configured to position the contact terminals 21 in a direction orthogonal to the axial direction; and an eighth housing 18 having electrical conductivity and stacked in the axial direction by sandwiching the sixth housing 16 between the eighth housing 18 and fifth housing 15, wherein the sixth housing 16 is provided with through-vias configured to form a conductive path in the axial direction.