Test Socket With Direct Probe-Block Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional test sockets for semiconductor chips have complex structures, making them difficult to manufacture and increasing costs due to the need for fine conductive patterns and PCBs, which complicates the power supply path and heat dissipation.
Innovation Solution
A test socket design featuring a simple structure with conductive and insulating blocks, gap members, and retractable probes that directly connect upper and lower brass blocks with electronic components, reducing the power supply path and enhancing heat dissipation and current capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional test socket uses a PCB with fine conductive patterns to connect probes and electric conductors, then the electrical connection is achieved, but the manufacturing complexity increases and manufacturing cost rises
Solution Approach 1:
The patent extracts the PCB and fine conductive patterns from the test socket structure, replacing them with direct mechanical and electrical connections between probes, electronic parts, and electric conductors. This eliminates the complex PCB layer while maintaining reliable electrical connectivity through simplified direct contacts.
Solution Approach 2:
The test socket is segmented into distinct functional components: probes for signal contact, electronic parts mounted on insulating members for power supply, and electric conductors for current flow. Each segment is independently designed and positioned, eliminating the need for integrated PCB routing and reducing overall structural complexity.
2Reliability
If a conventional test socket uses a PCB with fine conductive patterns, then electrical connection is achieved, but manufacturing difficulty increases
Solution Approach 1:
The PCB manufacturing process with its complex fine conductive patterns is completely extracted and removed from the design. Instead, the patent uses straightforward assembly of discrete components (probes, electronic parts, conductors) that can be manufactured and assembled using simpler, more accessible processes.
Solution Approach 2:
The patent replaces expensive, precision-manufactured PCBs with simpler, potentially disposable or easily replaceable components. The electronic parts are mounted on insulating members rather than permanent PCBs, allowing for easier manufacturing and potential cost reduction.
3Reliability
If a conventional test socket has a complex structure with PCB and fine conductive patterns, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The expensive PCB component with fine conductive patterns is extracted and removed entirely. The patent replaces it with cheaper alternative components (insulating members with mounted electronic parts) that achieve the same electrical connection function at lower cost.
Solution Approach 2:
The patent employs simpler, potentially disposable electronic parts mounted on insulating members rather than expensive permanent PCBs. This approach reduces manufacturing costs while maintaining the necessary electrical connectivity for testing functions.
4Reliability
If a conventional test socket uses PCB and complex structure, then electrical connection is achieved, but power supply path length increases
Solution Approach 1:
The PCB trace paths that contribute to power supply path length are extracted and removed. The patent replaces them with direct point-to-point connections between power sources, electronic parts, and load, significantly shortening the power supply path.
Solution Approach 2:
Instead of following the conventional PCB routing approach where power traces wind across the board, the patent inverts the connection topology by bringing power sources and loads into direct proximity through the probe-electronic part-conductor pathway, effectively reversing the traditional power distribution architecture.
5Reliability
If a conventional test socket has complex structure with PCB, then electrical connection is achieved, but heat dissipation performance deteriorates
Solution Approach 1:
The PCB, which acts as a thermal insulator and heat trap, is extracted and removed from the structure. The patent replaces it with direct metal-to-metal contacts and open-air pathways that facilitate much more effective heat dissipation from power-carrying components.
Solution Approach 2:
The patent uses simpler mounting structures (insulating members rather than PCBs) that allow for better thermal management. The discrete component arrangement enables heat to dissipate more freely compared to the confined thermal environment of a PCB-mounted structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design simplifies the manufacturing process, reduces power application path length, improves heat dissipation, and increases current capacity by direct contact between upper and lower blocks and electronic components.
Implementation Method 1
The first terminal contact portion and the second terminal contact portion may comprise a first conductive elastic member and a second conductive elastic member, respectively
Implementation Method 2
The test socket may further comprise springs respectively provided in the first groove and the second groove, and respectively making the first base member and the second base member be connected to the exposed first terminal and the exposed second terminal
Data Source
AI summary
Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.