Semiconductor Test Socket Electron-to-Heat Conversion Plate
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Solution Overview
Problem
Signal interference between pogo pins in semiconductor device test sockets due to emitted free electrons reduces the reliability of test results for high-frequency semiconductor devices.
Innovation Solution
A test socket design incorporating an electron-to-heat conversion plate and a heat sink wall to convert kinetic energy of free electrons into thermal energy, combined with a grid structure heat sink wall and hole carriers to effectively isolate and eliminate free electrons, preventing signal interference between pogo pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pogo pins are placed close together to increase testing capacity, then productivity is improved, but signal interference between adjacent pogo pins increases due to emitted free electrons
Solution Approach 1:
A ground pin is introduced as an intermediary element between adjacent signal-bearing pogo pins. This ground pin acts as a mediator that captures and redirects free electrons emitted from one pogo pin before they can interfere with adjacent pogo pins, thereby maintaining close spacing while preventing signal interference.
Solution Approach 2:
The patent applies different functional qualities to different pins in the array. Signal pogo pins are optimized for electrical connection, while ground pins are specifically designed to handle electron emission and provide shielding. This local differentiation allows the system to maintain high density while managing interference through specialized ground pin placement.
2Reliability
If pogo pins are separated by a larger distance to prevent signal interference, then reliability is improved, but productivity decreases due to reduced testing capacity
Solution Approach 1:
Ground pins serve as intermediary elements that enable close spacing of signal pogo pins without compromising reliability. By placing ground pins between signal pins, the system maintains intimate contact for reliable testing while the ground pins actively manage electron emission and prevent interference.
Solution Approach 2:
The patent transitions from one-dimensional spacing considerations to a two-dimensional pin arrangement. By utilizing both signal pins and ground pins in a grid-like pattern, the system achieves reliable signal transmission through strategic placement in multiple dimensions, allowing closer effective spacing while maintaining reliability.
3Object-affected harmful factors
If ground pins are added between pogo pins to prevent signal interference, then signal interference is reduced, but device complexity increases
Solution Approach 1:
The ground pins perform multiple functions: they provide electrical grounding, shield adjacent signal pins from electromagnetic interference, and structurally organize the pin array. This multi-functionality reduces the need for additional separate shielding components, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent merges the functions of signal transmission and interference shielding into a unified pin array structure. Ground pins are integrated directly into the socket matrix alongside signal pins, combining what could have been separate systems into a single cohesive structure, thereby minimizing added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces signal interference and increases the reliability of test results by efficiently converting and radiating thermal energy, as demonstrated by lower return and insertion losses, and reduced electric and magnetic field strengths between pogo pins.
Implementation Method 1
an electron-to-heat conversion plate supporting bottoms of the pogo pins, the electron-to-heat conversion plate configured to convert kinetic energy of free electrons emitted from the pogo pins to thermal energy
Implementation Method 2
a heat sink wall formed on the electron-to-heat conversion plate, the heat sink wall having a predetermined height and isolating the plurality of pogo pins from one another
Data Source
AI summary
A test socket for connecting a device under test (DUT) electrically to a high-frequency power source comprises a plurality of pogo pins each having an electrode, an electron-to-heat conversion plate supporting bottoms of the pogo pins, the electron-to-heat conversion plate configured to convert kinetic energy of free electrons emitted from the pogo pins to thermal energy, and a heat sink wall formed on the electron-to-heat conversion plate, the heat sink wall having a predetermined height and isolating the plurality of pogo pins from one another.