Test Socket Thermal Head Using Pressurized Fluid Package Retention
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Solution Overview
Problem
Existing semiconductor testing technologies face issues with stress concentrations and hot spots due to stand-offs, leading to die cracking and increased costs from custom manufacturing, while obstructing fluid flow and thermal parasitic resistance.
Innovation Solution
A thermal head assembly using a pressurized fluid to apply a load to the perimeter and top surface of a semiconductor package, ensuring optimal contact and eliminating the need for stand-offs by using a sealed chamber with a pressurized gas and liquid circulation for uniform pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If stand-offs are used to actuate the semiconductor package to the interconnect socket, then the package can be mechanically supported and positioned, but stress concentrations and hot spots are caused leading to die cracking
Solution Approach 1:
The patent removes stand-offs from the thermal head assembly, extracting the harmful mechanical contact points that cause stress concentrations. The sealing member is modified to eliminate protruding features, allowing uniform contact across the entire package surface without localized stress points.
Solution Approach 2:
The sealing member is designed with a compliant surface that provides locally adaptive contact pressure distribution. This allows different regions of the package to receive appropriate contact pressure, supporting mechanical strength while avoiding stress concentrations at specific points.
2Shape
If stand-offs are used to actuate the semiconductor package, then mechanical positioning is achieved, but hot spots are caused by obstructing fluid flow at the contact zone
Solution Approach 1:
The stand-offs are removed from the thermal head, eliminating the physical obstructions that block coolant flow. This allows uniform fluid circulation across the entire package surface, preventing hot spot formation while maintaining positioning through the compliant sealing member.
Solution Approach 2:
The patent uses pressurized fluid (gas or liquid) within the sealed chamber to provide uniform contact pressure and positioning of the semiconductor package. This hydraulic/pneumatic approach replaces the mechanical stand-off positioning system, enabling both positioning and improved thermal management through unobstructed fluid flow.
3Ease of operation
If stand-offs are used in the thermal head, then mechanical actuation is provided, but manufacturing costs increase due to high tolerance requirements
Solution Approach 1:
The complex stand-off components with high tolerance requirements are removed from the thermal head design. This simplification eliminates the need for costly custom manufacturing while the compliant sealing member provides the necessary mechanical actuation through material compliance rather than precision-machined features.
Solution Approach 2:
The patent changes the mechanical actuation approach from rigid stand-offs requiring precise dimensional control to a compliant sealing member where actuation is achieved through material properties (compliance) rather than tight tolerances. This parameter change from dimensional precision to material property-based actuation reduces manufacturing costs.
4Force
If stand-offs are used for package actuation, then contact force is applied, but die cracking occurs due to stress concentrations
Solution Approach 1:
The sealing member provides locally adaptive contact pressure that distributes force uniformly across the package surface. This local quality approach ensures adequate contact force for electrical connection while preventing stress concentrations that would compromise die integrity.
Solution Approach 2:
The patent achieves homogeneous force distribution across the package-contact interface by eliminating stand-offs and using a compliant sealing member. This uniform pressure distribution maintains die integrity while providing sufficient contact force for reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Mitigates stress concentrations and die cracking, enhances heat transfer, and reduces manufacturing costs by eliminating the need for costly stand-offs and improving thermal efficiency during testing.
Implementation Method 1
A thermal head assembly using a pressurized fluid to apply a load to the perimeter and top surface of a semiconductor package
Implementation Method 2
using a sealed chamber with a pressurized gas and liquid circulation for uniform pressure
Implementation Method 3
liquid circulation for uniform pressure... enhances heat transfer... improving thermal efficiency during testing
Data Source
Figure 1
Figure 2A~2A'
Figure 2B
AI summary
According to various aspects of the present disclosure, a semiconductor testing equipment may include a thermal head assembly having a body with a recess that is unobstructed and designed to fit over a die on the semiconductor package. A sealing member on the thermal head assembly engages a landing area on the semiconductor package to form a sealed chamber. The semiconductor package may be uniformly loaded by introducing a gas and incrementally increasing the gas pressure in the sealed chamber and increasing mechanical load on the sealing member onto the landing area to prevent leakage. Once the sealed chamber is fully sealed, the combined internal pressure from the circulating gas and a sealing perimeter load enables the proper socketing of the semiconductor package. Thereafter, the gas may be replaced with a circulating liquid refrigerant to remove the heat generated by the die during the testing of the semiconductor package.