Semiconductor Test Socket With Gel Thermal Interface for Heat Control
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Solution Overview
Problem
In semiconductor device testing under high-temperature conditions, excessive heat generation can cause the temperature inside the socket to rise above the set temperature, leading to inaccurate test results due to the low thermal conductivity of air filling the gaps between the semiconductor device and the socket.
Innovation Solution
A socket board design incorporating a heat conductive material made of macromolecular gel with metal-containing particles is used to fill the gaps between the semiconductor device and the socket, ensuring efficient heat dissipation and maintaining the test environment at the desired temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air fills the gaps between the semiconductor device and the socket, then the structure is simple and easy to manufacture, but the thermal conductivity is low causing heat accumulation and inaccurate test results
Solution Approach 1:
The patent introduces a heat conductive material as an intermediary substance between the semiconductor device and the socket. This material fills the gaps and improves thermal conductivity, allowing heat to be efficiently dissipated from the semiconductor device to the socket, thereby preventing heat accumulation and ensuring accurate test results under high-temperature conditions.
Solution Approach 2:
The patent employs a composite material consisting of a gel base combined with metal particles to create a heat conductive material. This composite structure combines the flexibility and gap-filling capability of the gel with the high thermal conductivity of metal particles, achieving both improved heat dissipation and ease of application in the socket structure.
2Temperature
If heat conductive material is added to the socket, then heat dissipation is improved and test accuracy is maintained, but the manufacturing process becomes more complex
Solution Approach 1:
The patent changes the physical state and thermal parameters of the material in the socket by introducing a heat conductive material with high thermal conductivity. This material fundamentally alters the heat transfer parameters in the socket, enabling efficient heat dissipation and maintaining controlled temperature conditions during semiconductor device testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the heat conductive material maintains accurate test results by preventing heat accumulation, allowing the semiconductor device to be tested under controlled temperature conditions, thereby improving the reliability of the inspection process.
Implementation Method 1
a heat conductive material that is disposed on the bottom portion of the socket to come into contact with the terminals of the semiconductor device held in the socket
Data Source
AI summary
A socket board used for testing a semiconductor device having one or more terminals, by raising a temperature of the semiconductor device to a predetermined temperature, includes a substrate, a socket that is provided on the substrate and capable of holding the semiconductor device, a pin that penetrates a bottom portion of the socket, and has an upper portion that is to come into contact with a terminal of the semiconductor device, and a heat conductive material that is disposed on the bottom portion of the socket to come into contact with the terminals of the semiconductor device held in the socket. The heat conductive material includes a macromolecular gel, and electrically-insulating metal-containing particles added to the macromolecular gel.