Test Socket Ground Line Array for High-Speed Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor test technologies face challenges in achieving high-speed operations with excellent signal transmission characteristics due to limitations in grounding and signal transmission efficiency during electrical property tests.
Innovation Solution
A test socket design featuring a two-dimensional array of terminals with a ground line extending along at least one row, electrically connected to a ground terminal, which improves signal transmission by positioning ground terminals and signal terminals in specific configurations to enhance signal characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional grounding methods are used in test sockets, then device compatibility is maintained, but signal transmission characteristics deteriorate at high speeds
Solution Approach 1:
The patent applies local quality by creating different grounding configurations for different regions of the test socket. Specifically, ground lines are positioned adjacent to signal lines in certain areas to provide shielding and reduce interference, while maintaining open configurations in other areas. This localized differentiation of grounding quality enables high-speed signal transmission in critical paths without compromising overall device compatibility.
Solution Approach 2:
The patent introduces ground lines as intermediary elements between signal lines and the ground terminal. These ground lines act as mediators that provide controlled impedance pathways and reduce signal interference. The ground lines are strategically positioned to intercept electromagnetic interference before it reaches signal lines, thereby improving signal transmission characteristics during high-speed testing.
2Reliability
If ground lines are added to improve signal transmission, then signal characteristics improve, but device complexity increases
Solution Approach 1:
The patent achieves universality by designing ground lines that serve multiple functions simultaneously. The same ground line structure provides both electrical grounding and electromagnetic shielding, while also defining the electrical characteristics of adjacent signal lines. This multi-functionality reduces the need for separate dedicated shielding structures, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent merges the grounding function with the signal transmission structure by integrating ground lines directly into the terminal array configuration. Rather than adding separate shielding components, the ground lines are combined with the existing terminal layout, allowing grounding and signal routing to be implemented in a unified structure that minimizes additional complexity.
3Reliability
If ground lines extend along multiple rows, then signal transmission improves, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the ground line configuration into discrete segments corresponding to specific signal line groups. Rather than implementing a continuous ground network across all rows, ground lines are segmented and placed only where needed adjacent to signal lines requiring high-speed transmission. This segmentation simplifies the manufacturing process by reducing the overall ground line length and complexity while maintaining signal transmission improvements in critical areas.
Data Source
AI summary
Provided are a test socket for a semiconductor device and a test device including the test socket. The test device includes a test socket including terminals arranged in a two-dimensional array and corresponding to terminals of the semiconductor device and a ground line extending along at least one row of two-dimensional array; and a substrate electrically connected to the test socket so as to transmit and receive a test signal. The test socket includes a ground line extending along at least one row of the two-dimensional array.