Semiconductor Test Socket Cover Support for Thin-Wall Guide Stability
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Solution Overview
Problem
The challenge is to design a test socket that minimizes size while preventing deformation or damage during semiconductor device inspections, ensuring stable support and motion of the cover.
Innovation Solution
A test socket with a base, cover, and support member that includes guide parts and grooves, integrated through injection molding, and a support member with enhanced strength to stabilize the cover's motion and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the size of the test socket is minimized to increase inspection efficiency, then the number of semiconductor devices that can be tested simultaneously increases, but the outer wall of the cover becomes thinner and the guide parts become damaged or deformed
Solution Approach 1:
The support member is divided into multiple support parts (first support part, second support part, third support part) that are distributed at different locations along the guide part. This segmentation allows the load to be distributed across multiple points, preventing localized stress concentration and deformation while maintaining the overall thin-walled structure of the cover.
Solution Approach 2:
The support member is formed from a material with higher strength than the cover material (e.g., metal support member in a plastic cover). This composite material approach allows the thin-walled cover to maintain structural integrity by using a stronger material specifically for the load-bearing support function, resolving the contradiction between thin walls and guide part strength.
2Volume of moving object
If the thickness of the outer wall of the cover is reduced to minimize test socket size, then the overall dimensions of the test socket decrease, but the guide part becomes more susceptible to damage during semiconductor device inspection
Solution Approach 1:
The support member provides localized reinforcement specifically at the guide part region where mechanical stress occurs during device inspection. The support parts are positioned at critical locations (first support part at first guide part, second support part at second guide part, third support part at outer surface) to provide targeted strength where needed, while the rest of the cover can remain thin to minimize overall size.
Solution Approach 2:
The support member acts as an intermediary structural element between the thin-walled cover and the semiconductor device being tested. It mediates the mechanical interactions by providing a stronger interface that protects the thin guide parts from direct contact stresses, preventing damage while maintaining the compact thin-walled design.
Data Source
AI summary
A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.