Test Socket for Image Sensor Module Using PWM Thermal Control
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Solution Overview
Problem
Existing high-temperature testing methods for image sensor modules are inefficient and prone to errors due to exposure of non-target components to high temperatures, leading to inaccurate results.
Innovation Solution
A test apparatus with a specialized test socket and controller that uses pulse width modulation to precisely control temperature, preventing exposure of non-target components and optimizing the test environment for image sensor modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high-temperature chamber is used to test image sensor modules, then high-temperature testing capability is achieved, but non-target components are exposed to high temperature causing testing errors
Solution Approach 1:
The patent divides the testing system into two separate thermal zones: a high-temperature chamber for the image sensor module and a room-temperature environment for other components. The test socket acts as an interface that segments the thermal exposure, allowing only the target component to experience high temperature while isolating non-target components through physical separation and selective heating mechanisms.
Solution Approach 2:
The patent applies local quality by creating a localized high-temperature environment specifically around the image sensor module using the test socket. The heating is concentrated where needed (on the sensor module) while other areas remain at room temperature. This is achieved through targeted heating elements within the test socket and controlled thermal pathways that direct heat only to the required component.
2Productivity
If all components are designed to operate at high temperatures to satisfy high-temperature testing, then testing can be performed, but design complexity and cost increase
Solution Approach 1:
The patent extracts the high-temperature testing function from the entire system and concentrates it only where needed - in the test socket and image sensor module area. By taking out the high-temperature requirement from the global system level and localizing it to the component level, the patent eliminates the need for all components to be high-temperature rated, thereby reducing design complexity while maintaining testing efficiency.
3Temperature
If a bulky high-temperature chamber is used for testing, then high-temperature testing is achieved, but the apparatus becomes expensive and noisy
Solution Approach 1:
The patent implements a nested structure where the test socket with integrated heating elements is placed inside the imaging device housing. The high-temperature generation components (heating elements, temperature sensors) are nested within the test socket, which itself is nested within the device housing. This nested arrangement compactly integrates the high-temperature testing functionality without requiring a separate bulky chamber, thereby reducing apparatus size while maintaining the required temperature testing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable and efficient high-temperature testing of image sensor modules, reducing errors and allowing simultaneous image capturing, thereby improving testing accuracy and efficiency.
Implementation Method 1
a heater configured to turn on and turn off based on a pulse width modulation signal and configured to emit heat to the image sensor module to cause a current temperature of the image sensor module to reach a target temperature
Implementation Method 2
a controller configured to generate a pulse width modulation signal to control a temperature of an image sensor module to be tested
Implementation Method 3
a socket temperature sensor configured to measure the current temperature
Data Source
AI summary
A test apparatus includes an image sensor module including a controller configured to generate a pulse width modulation signal to control a temperature of an image sensor module to be tested, and a test socket configured to emit heat to the image sensor module based on the pulse width modulation signal. The controller may control a duty ratio of the pulse width modulation signal based on a current temperature of the image sensor module, a target temperature and a criteria temperature range, and the criteria temperature range is a temperature range within a preset range from the target temperature.